SCHEMBL28510264

SCHEMBL28510264

O=Cc1ccc2c(c1)c1ccccc1n2-c1ccc(O)cc1

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PTGER4 P35408 3/20 0.49
KDM4E B2RXH2 3/20 0.46
ALDH1A1 P00352 2/20 0.46
ATM Q13315 1/20 0.44
L3MBTL1 Q9Y468 1/20 0.44
MEN1 O00255 7/20 0.44
KMT2A Q03164 7/20 0.44
SMN1; SMN2 Q16637 3/20 0.44
MAPT P10636 2/20 0.44
ALDH5A1 P51649 1/20 0.43
ABAT P80404 1/20 0.43
POLB P06746 7/20 0.42
HPGD P15428 2/20 0.42
RCE1 Q9Y256 1/20 0.42
KLK7 P49862 1/20 0.42
CASP6 P55212 1/20 0.40
CACNA1B Q00975 1/20 0.40
APBA1 Q02410 1/20 0.40
KIF11 P52732 1/20 0.40
APOBEC3A P31941 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28503786 0.92 ALDH5A1 (0.50) PTGER4KDM4EALDH1A1MEN1KMT2A
SCHEMBL17513001 0.91 KDM4E (0.54) PTGER4KDM4EALDH1A1ATML3MBTL1
SCHEMBL3659204 0.88 PTGER4 (0.51) PTGER4KDM4EALDH1A1ATML3MBTL1
SCHEMBL1199796 0.88 PTGER4 (0.51) PTGER4KDM4EALDH1A1ATML3MBTL1
SCHEMBL7163446 0.88 KDM4E (0.60) PTGER4KDM4EALDH1A1ATML3MBTL1
SCHEMBL28514655 0.86 PTGER4 (0.47) PTGER4KDM4EALDH1A1ATML3MBTL1
SCHEMBL7148016 0.85 PTGER4 (0.52) PTGER4KDM4EALDH1A1ATML3MBTL1
SCHEMBL13040780 0.85 PTGER4 (0.49) PTGER4KDM4EALDH1A1ATML3MBTL1
SCHEMBL28370714 0.84 KDM4E (0.50) PTGER4KDM4EALDH1A1ATML3MBTL1
SCHEMBL1200395 0.84 PTGER4 (0.48) PTGER4KDM4EALDH1A1ATML3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107406383-B Compound for lithography, resin, and underlayer film forming material 三菱瓦斯化学株式会社 2021-01-26 CN disclosed