⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethane SCHEMBL2828861 | 0.98 | — | — | |
| SCHEMBL3461600 | 0.77 | — | — | |
| SCHEMBL25400687 | 0.75 | — | — | |
| SCHEMBL142907 | 0.74 | — | — | |
| SCHEMBL3156273 | 0.74 | — | — | |
| SCHEMBL7934194 | 0.72 | ALDH1A1 (0.30) | — | |
| SCHEMBL14761886 | 0.71 | — | — | |
| SCHEMBL6261597 | 0.71 | — | — | |
| SCHEMBL21114057 | 0.71 | ALDH1A1 (0.32) | — | |
| SCHEMBL6658126 | 0.70 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 34 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115052929-B | Thermoplastic resin composition, method for preparing the same, and molded article manufactured using the same | 株式会社LG化学 | 2024-01-12 | — | — | CN | claimed |
| CN-115052929-A | Thermoplastic resin composition, method for preparing the same, and molded article manufactured using the same | 株式会社LG化学 | 2022-09-13 | — | — | CN | claimed |
| CN-112953430-B | Filter packaging method based on glass substrate and packaging structure thereof | 广东佛智芯微电子技术研究有限公司 | 2025-06-17 | — | — | CN | disclosed |
| US-12264249-B2 | Curable composition for inkjet, cured product and flexible printed circuit board | MICROCOSM TECHNOLOGY CO., LTD. (TW) | 2025-04-01 | — | — | US | disclosed |
| CN-119439622-A | Solder resist composition and printed wiring board having cured product thereof | 太阳油墨（苏州）有限公司 | 2025-02-14 | — | — | CN | disclosed |
| CN-113126430-B | Solder resist composition and printed wiring board having cured product thereof | 太阳油墨（苏州）有限公司 | 2024-12-06 | — | — | CN | disclosed |
| US-12091767-B2 | Laminate and preparing method thereof | MICROCOSM TECHNOLOGY CO., LTD. (TW) | 2024-09-17 | — | — | US | disclosed |
| CN-118510821-A | (Meth) acrylate-based resin and dry film solder resist comprising the same | 株式会社LG化学 | 2024-08-16 | — | — | CN | disclosed |
| CN-117642697-A | Curable resin composition, laminate, cured product, and electronic component | 太阳油墨（苏州）有限公司 | 2024-03-01 | — | — | CN | disclosed |
| CN-117616334-A | Curable resin composition, laminate, cured product, and electronic component | 太阳油墨（苏州）有限公司 | 2024-02-27 | — | — | CN | disclosed |
| CN-115052929-B | Thermoplastic resin composition, method for preparing the same, and molded article manufactured using the same | 株式会社LG化学 | 2024-01-12 | — | — | CN | disclosed |
| US-20220205123-A1 | Laminate and Preparing Method Thereof | MICROCOSM TECHNOLOGY CO., LTD. (TW) | 2022-06-30 | — | — | US | disclosed |
| CN-111094397-B | Polyimide resin and negative photosensitive resin composition containing same | 株式会社LG化学 | 2022-06-17 | — | — | CN | disclosed |
| CN-107436535-B | Photosensitive resin composition, dry film, cured product and printed wiring board | 太阳油墨制造株式会社 | 2022-06-10 | — | — | CN | disclosed |
| CN-114442425-A | Curable resin composition, solder resist film formed from the same, interlayer insulating material, and printed wiring board | 常州正洁智造科技有限公司 | 2022-05-06 | — | — | CN | disclosed |
| WO-2022089228-A1 | CURABLE RESIN COMPOSITION AND SOLDER RESIST FILM FORMED THEREFROM, INTERLAYER INSULATING MATERIAL, AND PRINTED CIRCUIT BOARD | 常州正洁智造科技有限公司 | 2022-05-05 | — | — | WO | disclosed |
| CN-107272334-B | Curable resin composition, dry film, cured product, and printed wiring board | 太阳油墨制造株式会社 | 2022-03-25 | — | — | CN | disclosed |
| CN-114175859-A | Insulating layer for multilayer printed circuit board, multilayer printed circuit board including the same, and method for manufacturing the same | 株式会社LG化学 | 2022-03-11 | — | — | CN | disclosed |
| CN-108884345-B | Curable composition for inkjet, cured product, and printed wiring board | 太阳油墨制造株式会社 | 2022-02-25 | — | — | CN | disclosed |
| CN-107075286-B | Curable composition for inkjet and method for producing electronic component | 积水化学工业株式会社 | 2021-03-09 | — | — | CN | disclosed |