Ether

Ether

SCHEMBL2853565

C1COC1.CCOCC

nearest known ligand 0.00

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⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ether SCHEMBL5328646 1.00 TSHR (0.43)
Ether SCHEMBL368206 0.89
Ether SCHEMBL10359647 0.88 TSHR (0.33)
Tetrahydrofuran SCHEMBL3966212 0.87 ALDH1A1 (0.50)
Tetrahydrofuran SCHEMBL139042 0.87 ALDH1A1 (0.50)
Tetrahydrofuran SCHEMBL2114570 0.87 ALDH1A1 (0.50)
Ether SCHEMBL27905943 0.87 ALDH1A1 (0.30)
Ether SCHEMBL233512 0.86 TTR (0.43)
Dioxane SCHEMBL1559719 0.86 TTR (0.43)
Ether SCHEMBL8643412 0.86

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023227950-A1 ENHANCED EUV PHOTORESISTS AND METHODS OF THEIR USE ROBINSON ALEX P G (GB) 2023-11-30 WO claimed
CN-107922620-B Low-temperature-curable composition, cured film, and electronic device 三星SDI株式会社 2021-06-08 CN claimed
WO-2023227950-A1 ENHANCED EUV PHOTORESISTS AND METHODS OF THEIR USE ROBINSON ALEX P G (GB) 2023-11-30 WO disclosed
CN-113891905-A High-temperature-resistant conductive thermosetting resin composition 帝克莱股份有限公司 2022-01-04 CN disclosed
WO-2020140109-A1 HIGH TEMPERATURE, CONDUCTIVE THERMOSETTING RESIN COMPOSITIONS Henkel IP & Holding GmbH (DE) 2020-07-02 WO disclosed
CN-110922882-A Solvent-free single-component polyurethane waterproof coating and production process thereof 宏源防水科技集团有限公司 2020-03-27 CN disclosed
CN-107207906-A For the resin combination of hard conating and including hard coat film of its cured form as coating 可隆工业株式会社 2017-09-26 CN disclosed
WO-2014152543-A2 OXETANE-CONTAINING COMPOUNDS AND COMPOSITIONS THEREOF Henkel IP & Holding GmbH (DE) 2014-09-25 WO disclosed
US-20140264165-A1 OXETANE-CONTAINING COMPOUNDS AND COMPOSITIONS THEREOF HENKEL CORPORATION (US) 2014-09-18 US disclosed
EP-2760910-A2 OXETANE-CONTAINING COMPOUNDS AND COMPOSITIONS THEREOF Henkel AG&Co. KGAA (DE) 2014-08-06 EP disclosed
US-20140209951-A1 OXETANE-CONTAINING COMPOUNDS AND COMPOSITIONS THEREOF Henkel IP & Holding GmbH (DE) 2014-07-31 US disclosed
JP-2006028116-A METHOD FOR PRODUCING OXETANE ETHER COMPOUND NIPPON STEEL CHEM CO LTD 2006-02-02 JP disclosed
JP-2006028116-A METHOD FOR PRODUCING OXETANE ETHER COMPOUND NIPPON STEEL CHEM CO LTD 2006-02-02 JP disclosed
JP-2003267961-A METHOD FOR PRODUCING OXETANE ETHER COMPOUND TOAGOSEI CO LTD 2003-09-25 JP disclosed
JP-2003267961-A METHOD FOR PRODUCING OXETANE ETHER COMPOUND TOAGOSEI CO LTD 2003-09-25 JP disclosed
EP-1337602-A1 POLYMERIZABLE LIQUID CRYSTALLINE DIOXETANES, THEIR PREPARATION AND USE Koninklijke Philips Electronics N.V. (NL) 2003-08-27 EP disclosed
US-6495636-B2 A 3-(ETHYLENEOXYALKYLOXYALKYL)OXETANE AND DERIVATIVES; COPOLYMERIZED WITH A 1,1-DIFLUOROETHYLENE OR DERIVATIVE; VERY COMPATIBLE AND COPOLYMERIZABLE WITH UNSATURATED COMPOUNDS; WATERPROOFING; RADIATION TRANSPARENT JSR CORPORATION (JP) 2002-12-17 US disclosed
WO-2002028985-A1 POLYMERIZABLE LIQUID CRYSTALLINE DIOXETANES, THEIR PREPARATION AND USE KONINKLIJKE PHILIPS ELECTRONICS N.V. (NL) 2002-04-11 WO disclosed
US-20010002423-A1 Oxetane compound, oxetane copolymer, and process for producing the oxetane compound SUGIYAMA NAOKI (JP) 2001-05-31 US disclosed
EP-1095938-A1 OXETANE COMPOUNDS, OXETANE COPOLYMER, AND PROCESS FOR PRODUCING OXETANE COMPOUNDS JSR Corporation (JP) 2001-05-02 EP disclosed