Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MAPK1 | P28482 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.32 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.32 |
| ▸ | TSHR | P16473 | 1/20 | 0.31 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4608409 | 0.80 | MAPK1 (0.37) | MAPK1ALDH1A1ALOX15 | |
| SCHEMBL28838178 | 0.78 | ALDH1A1 (0.57) | MAPK1ALDH1A1ALOX15 | |
| SCHEMBL29058028 | 0.74 | MAPK1 (0.85) | MAPK1ALDH1A1ALOX15TSHRTDP1 | |
| SCHEMBL20578229 | 0.74 | MAPK1 (0.85) | MAPK1ALDH1A1ALOX15TSHRTDP1 | |
| SCHEMBL22352 | 0.74 | MAPK1 (0.85) | MAPK1ALDH1A1ALOX15TSHRTDP1 | |
| SCHEMBL24702 | 0.74 | TSHR (0.35) | MAPK1ALDH1A1ALOX15TSHRTDP1 | |
| SCHEMBL1833534 | 0.74 | MAPK1 (0.85) | MAPK1ALDH1A1ALOX15TSHRTDP1 | |
| SCHEMBL5838774 | 0.74 | ESR1 (0.38) | MAPK1ALDH1A1ALOX15TSHRTDP1 | |
| SCHEMBL44643 | 0.73 | MAPK1 (0.58) | MAPK1ALDH1A1ALOX15TSHRTDP1 | |
| SCHEMBL28014690 | 0.72 | KIF11 (0.44) | MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-112724640-A | Thermosetting resin composition, prepreg using same and copper-clad laminate | 广东生益科技股份有限公司 | 2021-04-30 | — | — | CN | claimed |
| CN-112724640-B | Thermosetting resin composition, prepreg using same and copper-clad laminate | 广东生益科技股份有限公司 | 2022-09-16 | — | — | CN | disclosed |
| CN-112724640-A | Thermosetting resin composition, prepreg using same and copper-clad laminate | 广东生益科技股份有限公司 | 2021-04-30 | — | — | CN | disclosed |