⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2954137 | 0.90 | — | — | |
| SCHEMBL2865685 | 0.73 | — | — | |
| SCHEMBL27634677 | 0.71 | SIGMAR1 (0.30) | — | |
| SCHEMBL2869742 | 0.71 | — | — | |
| SCHEMBL3120953 | 0.70 | — | — | |
| SCHEMBL2856723 | 0.69 | — | — | |
| SCHEMBL1831836 | 0.69 | ALDH1A1 (0.32) | — | |
| SCHEMBL2947849 | 0.67 | — | — | |
| SCHEMBL25680619 | 0.67 | ALDH1A1 (0.32) | — | |
| SCHEMBL1834706 | 0.67 | ALDH1A1 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12466956-B2 | Electroconductive resin composition and molded article of same | DENKA COMPANY LIMITED (JP) | 2025-11-11 | — | — | US | disclosed |
| WO-2023189133-A1 | CONDUCTIVE RESIN COMPOSITION | デンカ株式会社 | 2023-10-05 | — | — | WO | disclosed |
| CN-112601786-B | Conductive resin composition and molded article thereof | 电化株式会社 | 2023-05-05 | — | — | CN | disclosed |
| US-20220392373-A1 | MUCOSAL TISSUE MODEL | DENKA COMPANY LIMITED (JP) | 2022-12-08 | — | — | US | disclosed |
| EP-4083969-A1 | MUCOSAL TISSUE MODEL | Denka Company Limited (JP) | 2022-11-02 | — | — | EP | disclosed |
| EP-3845600-B1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | DENKA COMPANY LTD (JP) | 2022-10-26 | — | — | EP | disclosed |
| CN-114787895-A | Mucosal tissue model | 电化株式会社 | 2022-07-22 | — | — | CN | disclosed |
| US-20210246314-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | DENKA COMPANY LIMITED (JP) | 2021-08-12 | — | — | US | disclosed |
| EP-3845600-A1 | ELECTROCONDUCTIVE RESIN COMPOSITION AND MOLDED ARTICLE OF SAME | Denka Company Limited (JP) | 2021-07-07 | — | — | EP | disclosed |
| CN-112601786-A | Conductive resin composition and molded article thereof | 电化株式会社 | 2021-04-02 | — | — | CN | disclosed |
| US-20090103241-A1 | Activated carbon prepared by carbonizing and activating a calixarene containing dihydroxybenzene rings; especially calcining at 400 degrees C. or less in the presence of an oxidative gas, calcining at 1500 degrees or less in an inactive gas, and then further calcining at 200-1500 degrees in H2O or CO2 | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2009-04-23 | — | — | US | disclosed |
| US-7470738-B2 | Non-aqueous absorbent and use thereof | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2008-12-30 | — | — | US | disclosed |
| US-20080094777-A1 | Electric double layer capacitor | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 2008-04-24 | — | — | US | disclosed |
| EP-1905740-A1 | ELECTRIC DOUBLE LAYER CAPACITOR | Sumitomo Chemical Company, Limited (JP) | 2008-04-02 | — | — | EP | disclosed |
| US-20070269987-A1 | Polishing Liquid for Cmp Process and Polishing Method | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2007-11-22 | — | — | US | disclosed |
| CN-1302021-C | Non-aqueous absorbent and use thereof | SANYO CHEMICAL IND LTD (JP) | 2007-02-28 | — | — | CN | disclosed |
| EP-1628334-A1 | POLISHING LIQUID FOR CMP PROCESS AND POLISHING METHOD | SANYO CHEMICAL INDUSTRIES LTD. (JP) | 2006-02-22 | — | — | EP | disclosed |
| US-20050136247-A1 | Non-aqueous absorbent and use thereof | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2005-06-23 | — | — | US | disclosed |
| CN-1610703-A | Non-aqueous absorbent and use thereof | SANYO CHEMICAL IND LTD (JP) | 2005-04-27 | — | — | CN | disclosed |
| EP-1462460-A1 | NON-AQUEOUS ABSORBENT AND USE THEREOF | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2004-09-29 | — | — | EP | disclosed |