⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL838470 | 0.72 | — | — | |
| SCHEMBL1053360 | 0.69 | — | — | |
| SCHEMBL28302833 | 0.69 | — | — | |
| SCHEMBL901539 | 0.69 | — | — | |
| SCHEMBL18878808 | 0.69 | ALDH1A1 (0.38) | — | |
| SCHEMBL18322822 | 0.69 | — | — | |
| SCHEMBL6510774 | 0.67 | — | — | |
| SCHEMBL12187736 | 0.67 | — | — | |
| SCHEMBL28237955 | 0.65 | — | — | |
| SCHEMBL28848780 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1786028-B1 | Coating solution for forming adhesion reinforcing layer and method of manufacturing a semiconductor device | FUJITSU LTD (JP) | 2013-06-05 | — | — | EP | disclosed |
| US-7830013-B2 | Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof | FUJITSU LIMITED (JP) | 2010-11-09 | — | — | US | disclosed |
| US-20070111539-A1 | Material for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof | FUJITSU LIMITED (JP) | 2007-05-17 | — | — | US | disclosed |
| EP-1786028-A1 | Coating solution for forming adhesion reinforcing layer, adhesion reinforcing layer, semiconductor device, and manufacturing method thereof | Fujitsu Ltd. (JP) | 2007-05-16 | — | — | EP | disclosed |