Glycerin

Glycerin

SCHEMBL2860442

CC(S)CC(=O)O.CC(S)CC(=O)O.OCC(O)CO

nearest known ligand 0.48

Full drug profile on Sugi Atlas →

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
SLC22A6 Q4U2R8 1/20 0.46
LMNA P02545 4/20 0.41
ALDH1A1 P00352 2/20 0.41
MAPT P10636 2/20 0.40
GABRR1 P24046 2/20 0.39
SMN1; SMN2 Q16637 1/20 0.37
GPR84 Q9NQS5 4/20 0.36
PTGS2 P35354 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
RNPEP Q9H4A4 1/20 0.33
CACNB3 P54284 1/20 0.33
CACNA2D1 P54289 1/20 0.33
CACNA1C Q13936 1/20 0.33
MME P08473 1/20 0.33
OR51E2 Q9H255 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Glycerin SCHEMBL15379735 1.00 SLC22A6 (0.46) SLC22A6LMNAALDH1A1MAPTGABRR1
Glycerin SCHEMBL869118 1.00 SLC22A6 (0.46) SLC22A6LMNAALDH1A1MAPTGABRR1
SCHEMBL4977866 0.90 SLC22A6 (0.41) SLC22A6LMNAALDH1A1MAPTGABRR1
Mercaptopropionic Acid SCHEMBL10002581 0.89 SLC22A6 (0.37) SLC22A6LMNAALDH1A1MAPTGABRR1
Propylene Glycol SCHEMBL870822 0.88 TDP1 (0.48) SLC22A6LMNAALDH1A1MAPTGABRR1
Propylene Glycol SCHEMBL14837301 0.88 TDP1 (0.48) SLC22A6LMNAALDH1A1MAPTGABRR1
SCHEMBL8612540 0.85
SCHEMBL20966262 0.85
SCHEMBL98745 0.85
Ethylene Glycol SCHEMBL869747 0.83 SLC22A6 (0.39) SLC22A6LMNAALDH1A1MAPTGABRR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8242217-B2 Epoxy resin curing agent, process for preparing the same, and epoxy resin composition SHOWA DENKO K.K. (JP) 2012-08-14 US disclosed
EP-2226347-B1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO KK (JP) 2012-06-27 EP disclosed
US-20100273940-A1 EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION SHOWA DENKO K.K. (JP) 2010-10-28 US disclosed
EP-2226347-A1 EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION Showa Denko K.K. (JP) 2010-09-08 EP disclosed