Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.46 |
| ▸ | LMNA | P02545 | 4/20 | 0.41 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.41 |
| ▸ | MAPT | P10636 | 2/20 | 0.40 |
| ▸ | GABRR1 | P24046 | 2/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.37 |
| ▸ | GPR84 | Q9NQS5 | 4/20 | 0.36 |
| ▸ | PTGS2 | P35354 | 1/20 | 0.34 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.34 |
| ▸ | RNPEP | Q9H4A4 | 1/20 | 0.33 |
| ▸ | CACNB3 | P54284 | 1/20 | 0.33 |
| ▸ | CACNA2D1 | P54289 | 1/20 | 0.33 |
| ▸ | CACNA1C | Q13936 | 1/20 | 0.33 |
| ▸ | MME | P08473 | 1/20 | 0.33 |
| ▸ | OR51E2 | Q9H255 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Glycerin SCHEMBL15379735 | 1.00 | SLC22A6 (0.46) | SLC22A6LMNAALDH1A1MAPTGABRR1 | |
| Glycerin SCHEMBL2860442 | 1.00 | SLC22A6 (0.46) | SLC22A6LMNAALDH1A1MAPTGABRR1 | |
| SCHEMBL4977866 | 0.90 | SLC22A6 (0.41) | SLC22A6LMNAALDH1A1MAPTGABRR1 | |
| Mercaptopropionic Acid SCHEMBL10002581 | 0.89 | SLC22A6 (0.37) | SLC22A6LMNAALDH1A1MAPTGABRR1 | |
| Propylene Glycol SCHEMBL870822 | 0.88 | TDP1 (0.48) | SLC22A6LMNAALDH1A1MAPTGABRR1 | |
| Propylene Glycol SCHEMBL14837301 | 0.88 | TDP1 (0.48) | SLC22A6LMNAALDH1A1MAPTGABRR1 | |
| SCHEMBL8612540 | 0.85 | — | — | |
| SCHEMBL20966262 | 0.85 | — | — | |
| SCHEMBL98745 | 0.85 | — | — | |
| Ethylene Glycol SCHEMBL869747 | 0.83 | SLC22A6 (0.39) | SLC22A6LMNAALDH1A1MAPTGABRR1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-2436715-B1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO KK (JP) | 2016-08-24 | — | — | EP | claimed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | claimed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | claimed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | claimed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | claimed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | claimed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | claimed |
| US-12492293-B2 | Multi-component systems for preparing foamed products | ARKEMA FRANCE (FR) | 2025-12-09 | — | — | US | disclosed |
| WO-2025125563-A1 | COUMARIN THIOESTER PHOTOINITIATORS | ARKEMA FRANCE (FR) | 2025-06-19 | — | — | WO | disclosed |
| EP-4570860-A1 | COUMARIN THIOESTER PHOTOINITIATORS | ARKEMA FRANCE (FR) | 2025-06-18 | — | — | EP | disclosed |
| EP-4570791-A1 | THIOESTER PHOTOINITIATORS | ARKEMA FRANCE (FR) | 2025-06-18 | — | — | EP | disclosed |
| WO-2024203009-A1 | RESIN, PASTE COMPOSITION, INORGANIC SINTERED BODY, ELECTRONIC DEVICE, AND SOLAR PANEL | 三菱ケミカル株式会社 | 2024-10-03 | — | — | WO | disclosed |
| EP-3891210-B1 | MULTI-COMPONENT SYSTEMS FOR PREPARING FOAMED PRODUCTS | ARKEMA FRANCE (FR) | 2023-08-23 | — | — | EP | disclosed |
| US-8865801-B2 | Epoxy resin-based coating composition | SHOWA DENKO K.K. (JP) | 2014-10-21 | — | — | US | disclosed |
| US-20130303651-A1 | PHOTOCURABLE MATERIAL FOR SEALING, SEALING METHOD, SEALING MATERIAL, AND HOUSING USING SAID SEALING MATERIAL | BOSTIK SA (FR) | 2013-11-14 | — | — | US | disclosed |
| US-8242217-B2 | Epoxy resin curing agent, process for preparing the same, and epoxy resin composition | SHOWA DENKO K.K. (JP) | 2012-08-14 | — | — | US | disclosed |
| EP-2226347-B1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20120077903-A1 | EPOXY RESIN-BASED COATING COMPOSITION | SHOWA DENKO K.K. (JP) | 2012-03-29 | — | — | US | disclosed |
| US-20100273940-A1 | EPOXY RESIN CURING AGENT, PROCESS FOR PREPARING THE SAME, AND EPOXY RESIN COMPOSITION | SHOWA DENKO K.K. (JP) | 2010-10-28 | — | — | US | disclosed |
| EP-2226347-A1 | EPOXY RESIN CURING AGENT, METHOD FOR PRODUCING THE SAME, AND EPOXY RESIN COMPOSITION | Showa Denko K.K. (JP) | 2010-09-08 | — | — | EP | disclosed |