⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1482876 | 0.71 | — | — | |
| SCHEMBL13915428 | 0.71 | — | — | |
| SCHEMBL2862870 | 0.71 | — | — | |
| SCHEMBL2869631 | 0.71 | — | — | |
| SCHEMBL6053267 | 0.67 | — | — | |
| SCHEMBL15157466 | 0.67 | — | — | |
| SCHEMBL14564288 | 0.67 | — | — | |
| SCHEMBL13915433 | 0.65 | — | — | |
| SCHEMBL14564284 | 0.64 | — | — | |
| SCHEMBL13915430 | 0.63 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 219 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-109742445-B | Bifunctional additive, electrolyte containing same and lithium ion battery | 东莞东阳光科研发有限公司 | 2021-09-10 | — | — | CN | claimed |
| WO-2014170799-A1 | CROSSLINKABLE VARNISH AND METHOD FOR APPLYING SAME | COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (FR) | 2014-10-23 | — | — | WO | claimed |
| US-8298965-B2 | Volatile precursors for deposition of C-linked SiCOH dielectrics | AMERICAN AIR LIQUIDE, INC. (US) | 2012-10-30 | — | — | US | claimed |
| US-8101236-B2 | Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bonding | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2012-01-24 | — | — | US | claimed |
| US-20100052115-A1 | Volatile Precursors for Deposition of C-Linked SiCOH Dielectrics | AMERICAN AIR LIQUIDE, INC. (US) | 2010-03-04 | — | — | US | claimed |
| US-20090181178-A1 | SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C BONDING, SEMICONDUCTOR DEVICE CONTAINING THE SAME, AND METHOD TO MAKE THE SAME | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2009-07-16 | — | — | US | claimed |
| US-20090101892-A1 | Organic underlayers that improve the performance of organic semiconductors | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2009-04-23 | — | — | US | claimed |
| US-20080265381-A1 | SiCOH DIELECTRIC | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2008-10-30 | — | — | US | claimed |
| US-7285440-B2 | Organic underlayers that improve the performance of organic semiconductors | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-10-23 | — | — | US | claimed |
| US-20070173071-A1 | SiCOH dielectric | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-07-26 | — | — | US | claimed |
| US-20060165891-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-07-27 | — | — | US | claimed |
| US-20060079099-A1 | Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-04-13 | — | — | US | claimed |
| US-20050194619-A1 | SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2005-09-08 | — | — | US | claimed |
| US-20040161873-A1 | Organic underlayers that improve the performance of organic semiconductors | INTERNATIONAL BUSINESS MACHINES CORPORATION | 2004-08-19 | — | — | US | claimed |
| US-12533709-B2 | Silacyclic compounds and methods for depositing silicon-containing films using same | VERSUM MATERIALS US, LLC (US) | 2026-01-27 | — | — | US | disclosed |
| US-20250319238-A1 | COATING COMPOSITION FOR MEDICAL IMPLANTS TO PREVENT FOREIGN SUBSTANCE ADHESION | LYNK SOLUTEC INC. (KR) | 2025-10-16 | — | — | US | disclosed |
| US-20250288731-A1 | COATING COMPOSITION FOR PROTECTION OF ENDOSCOPE | LYNK SOLUTEC INC (KR) | 2025-09-18 | — | — | US | disclosed |
| US-20020012872-A1 | Radiation-sensitive resin composition | JSR CORPORATION (JP) | 2002-01-31 | — | — | US | disclosed |
| EP-1164433-A1 | Radiation-sensitive resin composition | JSR Corporation (JP) | 2001-12-19 | — | — | EP | disclosed |
| WO-2001032789-A1 | CURABLE INKJET PRINTABLE INK COMPOSITIONS | 3M INNOVATIVE PROPERTIES COMPANY (US) | 2001-05-10 | — | — | WO | disclosed |