SCHEMBL2863277

SCHEMBL2863277

C#CC12CC3CC(C#C)(C1)CC(C#C)(C3)C2

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2188738 0.89
SCHEMBL2189741 0.87
SCHEMBL30971710 0.87
SCHEMBL13109254 0.85
SCHEMBL2323149 0.82 PKM (0.30)
SCHEMBL2189050 0.82 LMNA (0.32)
SCHEMBL2193017 0.80
SCHEMBL4442983 0.78
SCHEMBL2001702 0.75
SCHEMBL1199716 0.75 GRIN2D (0.38)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5017734-A Ethynyl adamantane derivatives and methods of polymerization thereof FLUOROCHEM INC., A CORP. OF CALIFORNIA 1991-05-21 US claimed
EP-1752476-B1 Insulating film formed by using a film-forming composition comprising a polymer and electronic device FUJIFILM CORP (JP) 2012-12-12 EP disclosed
US-7750102-B2 Insulating film for semiconductor integrated circuit FUJIFILM CORPORATION (JP) 2010-07-06 US disclosed
US-7612155-B2 Film forming composition, insulating film formed by use of the composition, and electronic device FUJIFILM CORPORATION (JP) 2009-11-03 US disclosed
US-20090221779-A1 FILM FORMING COMPOSITION, INSULATING FILM, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2009-09-03 US disclosed
US-7514513-B2 Polymer, film-forming composition comprising the polymer, insulating film formed by using the composition and electronic device FUJIFILM CORPORATION (JP) 2009-04-07 US disclosed
US-20090048421-A1 FILM FORMING COMPOSITION, FILM, AND ELECTRONIC DEVICE FUJIFILM CORPORATION (JP) 2009-02-19 US disclosed
US-20080251892-A1 INSULATING FILM FOR SEMICONDUCTOR INTEGRATED CIRCUIT FUJIFILM CORPORATION (JP) 2008-10-16 US disclosed
US-20070255003-A1 Film forming composition, insulating film formed by use of the composition, and electronic device FUJIFILM CORPORATION (JP) 2007-11-01 US disclosed
EP-1772469-A2 Polymer and film forming composition FUJIFILM Corporation (JP) 2007-04-11 EP disclosed
US-20070073020-A1 Polymer and film forming composition FUJI PHOTO FILM CO., LTD. 2007-03-29 US disclosed
US-20070037941-A1 Polymer formed by polymerizing a mono- or dialkynylbiadamantane in the presence of a free radical catalyst; polymer can be dissolved in cyclohexanone to a concentration of 1 mass % or more at 25 degrees C. and formed into dielectric thin films FUJI PHOTO FILM CO., LTD. 2007-02-15 US disclosed
EP-1752476-A1 Polymer, film-forming composition comprising the polymer, insulating film formed by using the composition and electronic device Fuji Photo Film Co., Ltd. (JP) 2007-02-14 EP disclosed
US-5017734-A Ethynyl adamantane derivatives and methods of polymerization thereof FLUOROCHEM INC., A CORP. OF CALIFORNIA 1991-05-21 US disclosed
US-5017734-A Ethynyl adamantane derivatives and methods of polymerization thereof FLUOROCHEM INC., A CORP. OF CALIFORNIA 1991-05-21 US disclosed