⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Hydrogen Peroxide SCHEMBL26665096 | 0.80 | ELANE (0.36) | — | |
| SCHEMBL538708 | 0.80 | ELANE (0.36) | — | |
| SCHEMBL607878 | 0.79 | DGAT1 (0.31) | — | |
| SCHEMBL28438743 | 0.79 | — | — | |
| SCHEMBL453140 | 0.78 | — | — | |
| SCHEMBL30636377 | 0.78 | — | — | |
| SCHEMBL607879 | 0.76 | ALDH1A1 (0.35) | — | |
| SCHEMBL9788269 | 0.76 | — | — | |
| SCHEMBL9849589 | 0.74 | — | — | |
| SCHEMBL28906743 | 0.74 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 15 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117980364-A | Curable organopolysiloxane composition, organopolysiloxane adhesive layer obtained by curing the same, and laminate | 陶氏东丽株式会社 | 2024-05-03 | — | — | CN | disclosed |
| CN-117940529-A | Curable organopolysiloxane composition, micro-adhesive organopolysiloxane adhesive layer obtained by curing the same, and laminate | 陶氏东丽株式会社 | 2024-04-26 | — | — | CN | disclosed |
| CN-117940471-A | Hot-melt curable polyorganosiloxane composition, cured product of the composition, and method for producing film or the like from the composition | 陶氏东丽株式会社 | 2024-04-26 | — | — | CN | disclosed |
| CN-117916280-A | Curable hot-melt silicone composition, cured product of the composition, and method for producing film or the like comprising the composition | 陶氏东丽株式会社 | 2024-04-19 | — | — | CN | disclosed |
| CN-113631660-B | Curable silicone composition, cured product thereof, and method for producing same | 陶氏东丽株式会社 | 2023-07-07 | — | — | CN | disclosed |
| CN-113631659-B | Curable silicone composition, cured product thereof, and method for producing same | 陶氏东丽株式会社 | 2023-05-05 | — | — | CN | disclosed |
| CN-113614174-B | Curable silicone composition, cured product thereof, and method for producing same | 陶氏东丽株式会社 | 2023-04-04 | — | — | CN | disclosed |
| CN-113396188-B | Curable silicone composition for transfer molding, cured product thereof, and method for producing same | 陶氏东丽株式会社 | 2023-01-17 | — | — | CN | disclosed |
| CN-113330071-B | Curable silicone composition, cured product thereof, and method for producing same | 陶氏东丽株式会社 | 2023-01-03 | — | — | CN | disclosed |
| CN-113631660-A | Curable silicone composition, cured product thereof, and method for producing same | 陶氏东丽株式会社 | 2021-11-09 | — | — | CN | disclosed |
| CN-113631659-A | Curable silicone composition, cured product thereof, and method for producing same | 陶氏东丽株式会社 | 2021-11-09 | — | — | CN | disclosed |
| CN-113614174-A | Curable silicone composition, cured product thereof, and method for producing same | 陶氏东丽株式会社 | 2021-11-05 | — | — | CN | disclosed |
| CN-113396188-A | Curable silicone composition for transfer molding, cured product thereof, and method for producing same | 陶氏东丽株式会社 | 2021-09-14 | — | — | CN | disclosed |
| CN-113396042-A | Method for producing curable silicone sheet having hot-melt property | 陶氏东丽株式会社 | 2021-09-14 | — | — | CN | disclosed |
| CN-113330071-A | Curable silicone composition, cured product thereof, and method for producing same | 陶氏东丽株式会社 | 2021-08-31 | — | — | CN | disclosed |