Predicted protein targets (top 6)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.31 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.31 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
| ▸ | MAPT | P10636 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL235279 | 0.95 | TSHR (0.39) | TSHRMEN1KMT2AALDH1A1TDP1 | |
| SCHEMBL5682726 | 0.86 | — | — | |
| SCHEMBL11955052 | 0.75 | TSHR (0.46) | TSHRMEN1KMT2AALDH1A1TDP1 | |
| SCHEMBL29144805 | 0.74 | TSHR (0.40) | TSHRMEN1KMT2AALDH1A1TDP1 | |
| SCHEMBL28930153 | 0.74 | MEN1 (0.37) | TSHRMEN1KMT2AALDH1A1TDP1 | |
| SCHEMBL14002143 | 0.73 | TSHR (0.43) | TSHRALDH1A1TDP1MAPT | |
| SCHEMBL12933281 | 0.73 | TSHR (0.43) | TSHRALDH1A1TDP1MAPT | |
| SCHEMBL4192196 | 0.72 | ALDH3A1 (0.35) | — | |
| SCHEMBL4185634 | 0.72 | ALDH3A1 (0.35) | — | |
| SCHEMBL13858659 | 0.71 | TSHR (0.42) | TSHRALDH1A1TDP1MAPT |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 27 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12109812-B2 | Ink jet printing method and ink jet printing apparatus | SEIKO EPSON CORPORATION (JP) | 2024-10-08 | — | — | US | disclosed |
| CN-114055975-A | Ink jet recording method and ink jet recording apparatus | 精工爱普生株式会社 | 2022-02-18 | — | — | CN | disclosed |
| US-20220032618-A1 | Ink Jet Printing Method And Ink Jet Printing Apparatus | SEIKO EPSON CORPORATION (JP) | 2022-02-03 | — | — | US | disclosed |
| US-10259208-B2 | Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2019-04-16 | — | — | US | disclosed |
| US-9579852-B2 | Method for manufacturing three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2017-02-28 | — | — | US | disclosed |
| US-20160339602-A1 | METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE | SEIKO EPSON CORPORATION (JP) | 2016-11-24 | — | — | US | disclosed |
| US-20160263829-A1 | THREE-DIMENSIONAL MODELING APPARATUS, MANUFACTURING METHOD, AND COMPUTER PROGRAM | SEIKO EPSON CORPORATION (JP) | 2016-09-15 | — | — | US | disclosed |
| US-9415545-B2 | Method of manufacturing three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2016-08-16 | — | — | US | disclosed |
| US-20160107385-A1 | THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING METHOD AND THREE-DIMENSIONAL SHAPED OBJECT | SEIKO EPSON CORPORATION (JP) | 2016-04-21 | — | — | US | disclosed |
| US-20150273765-A1 | METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE AND THREE-DIMENSIONAL STRUCTURE | SEIKO EPSON CORPORATION (JP) | 2015-10-01 | — | — | US | disclosed |
| US-8322033-B2 | Method for forming a conductive post for a multilayered wiring substrate | SEIKO EPSON CORPORATION (JP) | 2012-12-04 | — | — | US | disclosed |
| US-7776397-B2 | Process for producing chemical adsorption film and chemical adsorption film | SEIKO EPSON CORPORATION (JP) | 2010-08-17 | — | — | US | disclosed |
| US-20090077798-A1 | METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-26 | — | — | US | disclosed |
| US-20090071706-A1 | METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-19 | — | — | US | disclosed |
| US-7500895-B2 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2009-03-10 | — | — | US | disclosed |
| US-20080317943-A1 | METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | SEIKO EPSON CORPORATION (JP) | 2008-12-25 | — | — | US | disclosed |
| US-20080311285-A1 | CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD | SEIKO EPSON CORPORATION (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20060127563-A1 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2006-06-15 | — | — | US | disclosed |
| US-20060019034-A1 | Process for producing chemical adsorption film and chemical adsorption film | SEIKO EPSON CORPORATION (JP) | 2006-01-26 | — | — | US | disclosed |
| US-20050287392-A1 | Organic electroluminescent device, method for producing the same, and electronic apparatus | SEIKO EPSON CORPORATION (JP) | 2005-12-29 | — | — | US | disclosed |