Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP3A4 | P08684 | 6/20 | 0.42 |
| ▸ | CASP1 | P29466 | 1/20 | 0.42 |
| ▸ | RECQL | P46063 | 1/20 | 0.42 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.41 |
| ▸ | CPN1 | P15169 | 1/20 | 0.39 |
| ▸ | CPB2 | Q96IY4 | 1/20 | 0.39 |
| ▸ | TP53 | P04637 | 1/20 | 0.37 |
| ▸ | AOC3 | Q16853 | 1/20 | 0.36 |
| ▸ | CA1 | P00915 | 2/20 | 0.35 |
| ▸ | CA2 | P00918 | 2/20 | 0.35 |
| ▸ | CA9 | Q16790 | 2/20 | 0.35 |
| ▸ | CA12 | O43570 | 1/20 | 0.35 |
| ▸ | CA7 | P43166 | 1/20 | 0.35 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.35 |
| ▸ | CA14 | Q9ULX7 | 1/20 | 0.35 |
| ▸ | MAPKAPK2 | P49137 | 1/20 | 0.35 |
| ▸ | MAOB | P27338 | 1/20 | 0.35 |
| ▸ | KRAS | P01116 | 1/20 | 0.35 |
| ▸ | SOS1 | Q07889 | 1/20 | 0.35 |
| ▸ | ADRB1 | P08588 | 1/20 | 0.35 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9157662 | 0.82 | CYP3A4 (0.47) | CYP3A4CASP1RECQLALDH1A1CPN1 | |
| SCHEMBL20852303 | 0.82 | CYP3A4 (0.47) | CYP3A4CASP1RECQLALDH1A1CPN1 | |
| SCHEMBL272384 | 0.76 | CYP3A4 (0.52) | CYP3A4CASP1RECQLALDH1A1CPN1 | |
| SCHEMBL104340 | 0.76 | CYP3A4 (0.52) | CYP3A4CASP1RECQLALDH1A1CPN1 | |
| SCHEMBL30349751 | 0.76 | CYP3A4 (0.52) | CYP3A4CASP1RECQLALDH1A1CPN1 | |
| SCHEMBL27483864 | 0.76 | CPN1 (0.39) | CYP3A4CASP1RECQLALDH1A1CPN1 | |
| SCHEMBL7359754 | 0.76 | CPN1 (0.39) | CYP3A4CASP1RECQLALDH1A1CPN1 | |
| SCHEMBL7359740 | 0.76 | CPN1 (0.39) | CYP3A4CASP1RECQLALDH1A1CPN1 | |
| SCHEMBL8953959 | 0.74 | CYP3A4 (0.37) | CYP3A4CASP1RECQLALDH1A1CPN1 | |
| SCHEMBL2804400 | 0.74 | MAPT (0.38) | CYP3A4ALDH1A1TP53TDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12109812-B2 | Ink jet printing method and ink jet printing apparatus | SEIKO EPSON CORPORATION (JP) | 2024-10-08 | — | — | US | disclosed |
| CN-114055975-B | Ink jet recording method and ink jet recording apparatus | 精工爱普生株式会社 | 2023-05-12 | — | — | CN | disclosed |
| CN-114055975-A | Ink jet recording method and ink jet recording apparatus | 精工爱普生株式会社 | 2022-02-18 | — | — | CN | disclosed |
| US-20220032618-A1 | Ink Jet Printing Method And Ink Jet Printing Apparatus | SEIKO EPSON CORPORATION (JP) | 2022-02-03 | — | — | US | disclosed |
| US-10259208-B2 | Three-dimensional shaped object manufacturing device, method for manufacturing three-dimensional shaped object, and three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2019-04-16 | — | — | US | disclosed |
| US-9579852-B2 | Method for manufacturing three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2017-02-28 | — | — | US | disclosed |
| US-20160339602-A1 | METHOD OF MANUFACTURING THREE-DIMENSIONAL STRUCTURE, THREE-DIMENSIONAL STRUCTURE MANUFACTURING APPARATUS, AND THREE-DIMENSIONAL STRUCTURE | SEIKO EPSON CORPORATION (JP) | 2016-11-24 | — | — | US | disclosed |
| US-20160263829-A1 | THREE-DIMENSIONAL MODELING APPARATUS, MANUFACTURING METHOD, AND COMPUTER PROGRAM | SEIKO EPSON CORPORATION (JP) | 2016-09-15 | — | — | US | disclosed |
| US-9415545-B2 | Method of manufacturing three-dimensional shaped object | SEIKO EPSON CORPORATION (JP) | 2016-08-16 | — | — | US | disclosed |
| US-20160107385-A1 | THREE-DIMENSIONAL SHAPED OBJECT MANUFACTURING METHOD AND THREE-DIMENSIONAL SHAPED OBJECT | SEIKO EPSON CORPORATION (JP) | 2016-04-21 | — | — | US | disclosed |
| US-8322033-B2 | Method for forming a conductive post for a multilayered wiring substrate | SEIKO EPSON CORPORATION (JP) | 2012-12-04 | — | — | US | disclosed |
| US-7776397-B2 | Process for producing chemical adsorption film and chemical adsorption film | SEIKO EPSON CORPORATION (JP) | 2010-08-17 | — | — | US | disclosed |
| US-20090077798-A1 | METHOD FOR FORMING CONDUCTIVE POST, METHOD FOR MANUFACTURING MULTILAYERED WIRING SUBSTRATE, AND METHOD FOR MANUFACTURING ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-26 | — | — | US | disclosed |
| US-20090071706-A1 | METHOD FOR PRODUCING MULTILAYERED WIRING SUBSTRATE, MULTILAYERED WIRING SUBSTRATE, AND ELECTRONIC APPARATUS | SEIKO EPSON CORPORATION (JP) | 2009-03-19 | — | — | US | disclosed |
| US-7500895-B2 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2009-03-10 | — | — | US | disclosed |
| US-20080317943-A1 | METHOD FOR FORMING PATTERN, METHOD FOR MANUFACTURING ELECTRO-OPTICAL DEVICE, AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE | SEIKO EPSON CORPORATION (JP) | 2008-12-25 | — | — | US | disclosed |
| US-20080311285-A1 | CONTACT HOLE FORMING METHOD, CONDUCTING POST FORMING METHOD, WIRING PATTERN FORMING METHOD, MULTILAYERED WIRING SUBSTRATE PRODUCING METHOD, ELECTRO-OPTICAL DEVICE PRODUCING METHOD, AND ELECTRONIC APPARATUS PRODUCING METHOD | SEIKO EPSON CORPORATION (JP) | 2008-12-18 | — | — | US | disclosed |
| US-20060127563-A1 | Patterned substrate, electro-optical device, and method for manufacturing an electro-optical device | SEIKO EPSON CORPORATION (JP) | 2006-06-15 | — | — | US | disclosed |
| US-20060019034-A1 | Process for producing chemical adsorption film and chemical adsorption film | SEIKO EPSON CORPORATION (JP) | 2006-01-26 | — | — | US | disclosed |
| US-20050287392-A1 | Organic electroluminescent device, method for producing the same, and electronic apparatus | SEIKO EPSON CORPORATION (JP) | 2005-12-29 | — | — | US | disclosed |