SCHEMBL272384

SCHEMBL272384

CC(c1cccc(N)c1)c1cccc(N)c1

nearest known ligand 0.52

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CYP3A4 P08684 6/20 0.52
CASP1 P29466 2/20 0.52
RECQL P46063 1/20 0.52
CPN1 P15169 1/20 0.44
CPB2 Q96IY4 1/20 0.44
ALDH1A1 P00352 5/20 0.43
CA1 P00915 2/20 0.42
CA2 P00918 2/20 0.42
CA9 Q16790 2/20 0.42
CA12 O43570 1/20 0.42
CA7 P43166 1/20 0.42
TDP1 Q9NUW8 1/20 0.42
CA14 Q9ULX7 1/20 0.42
MAOA P21397 1/20 0.41
ADRB1 P08588 1/20 0.41
MIF P14174 1/20 0.41
HTR2A P28223 1/20 0.41
ADRA1A P35348 1/20 0.41
HTR2B P41595 1/20 0.41
MAPKAPK2 P49137 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3482673 0.95 CYP3A4 (0.48) CYP3A4CASP1RECQLCPN1CPB2
SCHEMBL15171130 0.93 MAOA (0.46) CYP3A4CASP1RECQLCPN1CPB2
SCHEMBL927270 0.91 CYP3A4 (0.44) CYP3A4CASP1RECQLCPN1CPB2
SCHEMBL25128183 0.89 ACHE (0.48) CYP3A4CASP1RECQLCPN1CPB2
SCHEMBL17073473 0.89 CYP3A4 (0.42) CYP3A4CASP1RECQLCPN1CPB2
SCHEMBL25128159 0.89 ACHE (0.48) CYP3A4CASP1RECQLCPN1CPB2
SCHEMBL17073489 0.88 CYP3A4 (0.41) CYP3A4CASP1RECQLCPN1CPB2
SCHEMBL9755239 0.86 ESR1 (0.59) CYP3A4CASP1RECQLCPN1CPB2
SCHEMBL5893842 0.86 MAPKAPK2 (0.49) CYP3A4CASP1RECQLCPN1CPB2
SCHEMBL104340 0.85 CYP3A4 (0.52) CYP3A4CASP1RECQLCPN1CPB2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 287 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1579272-A4 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS FUJIFILM ELECTRONIC MATERIALS (US) 2008-12-17 EP claimed
US-7416830-B2 Photosensitive resin compositions FUJIFILM ELECTRONIC MATERIALS U.S.A., INC. (US) 2008-08-26 US claimed
EP-1680711-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS Fujifilm Electronic Materials USA, Inc. (US) 2006-07-19 EP claimed
US-7018776-B2 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems ARCH SPECIALTY CHEMICALS, INC. (US) 2006-03-28 US claimed
US-20060063095-A9 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2006-03-23 US claimed
EP-1609026-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE FujiFilm Electronic Materials USA, Inc. (US) 2005-12-28 EP claimed
EP-1579272-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOSITIONS FOR USE IN BILAYER IMAGING SYSTEMS Fujifilm Electronic Materials USA, Inc. (US) 2005-09-28 EP claimed
US-20050181297-A1 Novel photosensitive resin compositions ARCH SPECIALTY CHEMICALS, INC. 2005-08-18 US claimed
WO-2005038524-A2 NOVEL PHOTOSENSITIVE RESIN COMPOSITIONS ARCH SPECIALTY CHEMICALS, INC. (US) 2005-04-28 WO claimed
US-20040161711-A1 Stable non-photosensitive polyimide precursor compositions for use in bilayer imaging systems ARCH SPECIALTY CHEMICALS, INC. 2004-08-19 US claimed
US-20040161619-A1 Process for producing a heat resistant relief structure ARCH SPECIALTY CHEMICALS, INC. 2004-08-19 US claimed
WO-2004055592-A2 STABLE NON-PHOTOSENSITIVE POLYIMIDE PRECURSOR COMPOISTIONS FOR USE IN BILAYER IMAGING SYSTEMS ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO claimed
WO-2004055593-A2 PROCESS FOR PRODUCING A HEAT RESISTANT RELIEF STRUCTURE ARCH SPECIALTY CHEMICALS, INC. (US) 2004-07-01 WO claimed
US-4399307-A DISTILLATION OF CARBOCYCLIC AMINES USING SOLVENTS PHILLIPS PETROLEUM COMPANY (US) 1983-08-16 US claimed
US-11958806-B2 Production method of maleimide UNITIKA LTD. (JP) 2024-04-16 US disclosed
WO-2024071066-A1 METAL-CLAD LAMINATED PLATE 日鉄ケミカル&マテリアル株式会社 2024-04-04 WO disclosed
WO-2023189319-A1 AMINO COMPOUND, POLYAMIDE ACID AND POLYIMIDE USING SAID AMINO COMPOUND, AND METHOD FOR PRODUCING SAME 日鉄ケミカル&マテリアル株式会社 2023-10-05 WO disclosed
US-4923954-A Production of particulate polyimide polymers ETHYL CORPORATION (US) 1990-05-08 US disclosed
EP-0365311-A1 Production process of an insulated wire MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-04-25 EP disclosed
US-4399307-A DISTILLATION OF CARBOCYCLIC AMINES USING SOLVENTS PHILLIPS PETROLEUM COMPANY (US) 1983-08-16 US disclosed