SCHEMBL2870029

SCHEMBL2870029

Clc1ccc(Cc2ncc[nH]2)cc1

nearest known ligand 0.67

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
TAAR1 Q96RJ0 9/20 0.67
HTR1A P08908 1/20 0.45
ADRA2A P08913 1/20 0.42
ADRA2B P18089 1/20 0.42
ADRA2C P18825 1/20 0.42
CYP19A1 P11511 1/20 0.42
ALOX15 P16050 1/20 0.40
PRNP P04156 1/20 0.40
MAPT P10636 1/20 0.40
CYP2D6 P10635 1/20 0.39
TSHR P16473 1/20 0.39
DAO P14920 1/20 0.39
NR1H2 P55055 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13372830 0.90 TAAR1 (0.80) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL11701063 0.87 TAAR1 (0.53) TAAR1
SCHEMBL11353272 0.87 TAAR1 (0.61) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL11295562 0.82 TAAR1 (0.69) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL177767 0.81 TAAR1 (0.67) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL6323409 0.81 TAAR1 (0.67) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL5678387 0.81 TAAR1 (0.56) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL3645596 0.81 TAAR1 (0.67) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL8210853 0.81 TAAR1 (0.67) TAAR1HTR1AADRA2AADRA2BADRA2C
SCHEMBL11290384 0.81 TAAR1 (0.67) TAAR1HTR1AADRA2AADRA2BADRA2C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107971655-B High-heat-resistance organic solder flux and application thereof 永星化工(上海)有限公司 2019-12-27 CN disclosed
US-10398028-B2 Surface treating composition for copper and copper alloy and utilization thereof SHIKOKU CHEMICALS CORPORATION (JP) 2019-08-27 US disclosed
CN-107971655-A A kind of high heat-resistance organic solder ability preservative and its application 永星化工(上海)有限公司 2018-05-01 CN disclosed
US-9649713-B2 Surface treating composition for copper and copper alloy and utilization thereof SHIKOKU CHEMICALS CORPORATION (JP) 2017-05-16 US disclosed
US-20170064823-A1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2017-03-02 US disclosed
US-9532493-B2 Surface treating composition for copper and copper alloy and utilization thereof SHIKOKU CHEMICALS CORPORATION (JP) 2016-12-27 US disclosed
CN-103547706-B Surface treatment composition for copper and copper alloy and use thereof 四国化成工业株式会社 2016-09-28 CN disclosed
CN-103620088-B For surface treating composition and the utilization thereof of copper and copper alloy SHIKOKU CHEMICALS CORP. (JP) 2015-11-25 CN disclosed
EP-2721195-B1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF SHIKOKU CHEM (JP) 2015-07-08 EP disclosed
EP-2714962-B1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF SHIKOKU CHEM (JP) 2015-07-08 EP disclosed
WO-2012176591-A1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2012-12-27 WO disclosed
WO-2012161341-A1 SURFACE TREATING COMPOSITION FOR COPPER AND COPPER ALLOY AND UTILIZATION THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2012-11-29 WO disclosed
CN-102137953-A Surface treating agent for copper or copper alloy and application thereof SHIKOKU CHEM 2011-07-27 CN disclosed
CN-102131959-A Surface treating agent for copper or copper alloy and application thereof SHIKOKU CHEM 2011-07-20 CN disclosed
CN-102119240-A Surface treating agent for copper or copper alloy and use thereof SHIKOKU CHEM 2011-07-06 CN disclosed
WO-2010024472-A1 SURFACE TREATING AGENT FOR COPPER OR COPPER ALLOY AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2010-03-04 WO disclosed
WO-2010024421-A1 SURFACE TREATING AGENT FOR COPPER OR COPPER ALLOY AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2010-03-04 WO disclosed
WO-2010016620-A1 SURFACE TREATING AGENT FOR COPPER OR COPPER ALLOY AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-11 WO disclosed
WO-2010016620-A1 SURFACE TREATING AGENT FOR COPPER OR COPPER ALLOY AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2010-02-11 WO disclosed
EP-0064820-A1 Substituted imidazole and imidazoline derivatives and their preparation and use Farmos-Yhtyma Oy (FI) 1982-11-17 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-10398028-B2 Surface treating composition for copper and copper alloy and utilization thereof SOD1, SOD3, AOC3 TAAR1 721/4885HTR1A 3473/4885ADRA2A 3711/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.