Acrylic Acid

Acrylic Acid

SCHEMBL2870809

C=CC(=O)O.CCCCCCCCCC(O)(Oc1ccccc1)C(C)O

nearest known ligand 0.45

Full drug profile on Sugi Atlas →

Predicted protein targets (top 13)

geneUniProtsupporting neighboursconfidence
MBOAT4 Q96T53 1/20 0.39
THRB P10828 2/20 0.38
THRA P10827 1/20 0.38
ZDHHC2 Q9UIJ5 1/20 0.38
GAA P10253 1/20 0.37
PPARG P37231 2/20 0.37
PPARA Q07869 2/20 0.37
ALDH1A1 P00352 2/20 0.36
ASAH1 Q13510 1/20 0.36
ACER2 Q5QJU3 1/20 0.36
S1PR1 P21453 1/20 0.35
S1PR3 Q99500 1/20 0.35
NAAA Q02083 2/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL27554562 0.90 CNR1 (0.39) GAAPPARGPPARAALDH1A1ASAH1
Acrylic Acid SCHEMBL496491 0.80 THRB (0.42) MBOAT4THRBTHRAZDHHC2GAA
Acrylic Acid SCHEMBL6297647 0.80 MEN1 (0.44) MBOAT4THRBTHRAGAAALDH1A1
SCHEMBL11299786 0.77 MEN1 (0.39) MBOAT4GAAPPARGPPARAALDH1A1
Acrylic Acid SCHEMBL27883411 0.75 THRB (0.39) MBOAT4THRBTHRAZDHHC2GAA
SCHEMBL11506202 0.75 CNR1 (0.41) MBOAT4GAAPPARGPPARAALDH1A1
SCHEMBL11547684 0.74 CNR1 (0.38) MBOAT4GAAPPARGPPARAALDH1A1
Acrylic Acid SCHEMBL15322566 0.74 MEN1 (0.41) MBOAT4THRBTHRAZDHHC2GAA
Acrylic Acid SCHEMBL8414681 0.74 MEN1 (0.41) MBOAT4THRBTHRAZDHHC2GAA
Acrylic Acid SCHEMBL15376926 0.74 MEN1 (0.41) MBOAT4THRBTHRAZDHHC2GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-103576452-A Light-curing thermal-curing resin composition SHANGHAI FUSAITE NEW MATERIAL CO LTD 2014-02-12 CN disclosed
CN-103576459-A Light-curing thermal-curing resin composition SHANGHAI FUSAITE NEW MATERIAL CO LTD 2014-02-12 CN disclosed
US-7762870-B2 Polishing pad and cushion layer for polishing pad TOYO TIRE & RUBBER CO., LTD (JP) 2010-07-27 US disclosed
US-7641540-B2 Polishing pad and cushion layer for polishing pad TOYO TIRE & RUBBER CO., LTD (JP) 2010-01-05 US disclosed
US-7329170-B2 Method of producing polishing pad TOYO TIRE & RUBBER CO., LTD. (JP) 2008-02-12 US disclosed
US-7192340-B2 Polishing pad, method of producing the same, and cushion layer for polishing pad TOYO TIRE & RUBBER CO., LTD. (JP) 2007-03-20 US disclosed
US-20060148391-A1 Polishing pad and cushion layer for polishing pad ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2006-07-06 US disclosed
US-20060148393-A1 Polishing pad and cushion layer for polishing pad ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2006-07-06 US disclosed
US-20060148392-A1 Method of producing polishing pad ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2006-07-06 US disclosed
US-20040055223-A1 Polishing pad, method of manufacturing the polishing pad, and cushion layer for polishing pad ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. 2004-03-25 US disclosed
US-20040048978-A1 Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board KANEKA CORPORATION (JP) 2004-03-11 US disclosed