Predicted protein targets (top 1)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CA1 | P00915 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10792004 | 0.81 | DNM1 (0.33) | CA1 | |
| SCHEMBL31742452 | 0.78 | — | — | |
| SCHEMBL9561819 | 0.74 | CA1 (0.35) | CA1 | |
| SCHEMBL16424593 | 0.73 | CA1 (0.30) | CA1 | |
| SCHEMBL2100625 | 0.72 | — | — | |
| SCHEMBL11849080 | 0.69 | CA1 (0.32) | CA1 | |
| SCHEMBL27034987 | 0.69 | CA1 (0.35) | CA1 | |
| SCHEMBL28722687 | 0.69 | CA1 (0.32) | CA1 | |
| SCHEMBL20500162 | 0.69 | — | — | |
| SCHEMBL232672 | 0.69 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-122029986-A | Processing method, semiconductor device manufacturing method, processing device, and program | 株式会社国际电气 | 2026-05-12 | — | — | CN | disclosed |
| US-20250376758-A1 | SELECTIVE DEPOSITION OF METAL-CONTAINING MATERIAL | ASM IP HOLDING BV (NL) | 2025-12-11 | — | — | US | disclosed |
| CN-119866535-A | Substrate processing method, semiconductor device manufacturing method, substrate processing apparatus, and program | 株式会社国际电气 | 2025-04-22 | — | — | CN | disclosed |
| CN-119694880-A | Processing method, semiconductor device manufacturing method, processing device, and recording medium | 株式会社国际电气 | 2025-03-25 | — | — | CN | disclosed |
| CN-117882176-A | Substrate processing method, semiconductor device manufacturing method, substrate processing apparatus, and program | 株式会社国际电气 | 2024-04-12 | — | — | CN | disclosed |
| CN-117766384-A | Substrate processing method, semiconductor device manufacturing method, substrate processing system, and recording medium | 株式会社国际电气 | 2024-03-26 | — | — | CN | disclosed |
| CN-117766374-A | Substrate processing method, semiconductor device manufacturing method, substrate processing system, and recording medium | 株式会社国际电气 | 2024-03-26 | — | — | CN | disclosed |
| CN-117702084-A | Substrate processing method, semiconductor device manufacturing method, substrate processing apparatus, and recording medium | 株式会社国际电气 | 2024-03-15 | — | — | CN | disclosed |
| CN-117253819-A | Substrate processing method, semiconductor device manufacturing method, substrate processing apparatus, and recording medium | 株式会社国际电气 | 2023-12-19 | — | — | CN | disclosed |
| CN-117121172-A | Method for manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and program | 株式会社国际电气 | 2023-11-24 | — | — | CN | disclosed |
| CN-116752120-A | Substrate processing method, semiconductor device manufacturing method, substrate processing apparatus, and recording medium | 株式会社国际电气 | 2023-09-15 | — | — | CN | disclosed |
| CN-116246942-A | Substrate processing method, semiconductor device manufacturing method, substrate processing apparatus, and recording medium | 株式会社国际电气 | 2023-06-09 | — | — | CN | disclosed |
| CN-115881512-A | Substrate processing method, method for manufacturing semiconductor device, storage medium, and substrate processing apparatus | 株式会社国际电气 | 2023-03-31 | — | — | CN | disclosed |
| CN-115810542-A | Substrate processing method, method for manufacturing semiconductor device, substrate processing apparatus, and program | 株式会社国际电气 | 2023-03-17 | — | — | CN | disclosed |
| CN-115692170-A | Substrate processing method, method for manufacturing semiconductor device, substrate processing apparatus, and recording medium | 株式会社国际电气 | 2023-02-03 | — | — | CN | disclosed |
| WO-2022264430-A1 | SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND PROGRAM | 株式会社KOKUSAI ELECTRIC | 2022-12-22 | — | — | WO | disclosed |
| CN-115224102-A | Substrate processing method, method for manufacturing semiconductor device, substrate processing apparatus, and recording medium | 株式会社国际电气 | 2022-10-21 | — | — | CN | disclosed |
| CN-114334605-A | Method for manufacturing semiconductor device, method for processing substrate, substrate processing apparatus, and storage medium | 株式会社国际电气 | 2022-04-12 | — | — | CN | disclosed |