SCHEMBL10792004

SCHEMBL10792004

CCCCN(CCCC)[Si](CC)(CC)N(CCCC)CCCC

nearest known ligand 0.33

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
DNM1 Q05193 3/20 0.33
TSHR P16473 2/20 0.33
LMNA P02545 1/20 0.33
CA12 O43570 3/20 0.32
CA1 P00915 3/20 0.32
CA9 Q16790 3/20 0.32
ALDH1A1 P00352 1/20 0.32
ALDH2 P05091 1/20 0.32
THRB P10828 1/20 0.32
MMP1 P03956 1/20 0.30
MMP2 P08253 1/20 0.30
MMP3 P08254 1/20 0.30
MMP8 P22894 1/20 0.30
CA2 P00918 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28720429 0.81 CA1 (0.30) CA1
SCHEMBL9561174 0.78 TSHR (0.40) DNM1TSHRLMNACA12CA1
SCHEMBL17138346 0.77 MMP1 (0.34) DNM1TSHRLMNACA12CA1
SCHEMBL17553066 0.74 DNM1 (0.32) DNM1TSHRLMNACA12CA1
SCHEMBL3319169 0.73 TSHR (0.35) DNM1TSHRLMNACA12CA1
SCHEMBL11549407 0.73 TSHR (0.35) DNM1TSHRLMNACA12CA1
SCHEMBL3310539 0.73 TSHR (0.35) DNM1TSHRLMNACA12CA1
SCHEMBL234683 0.72 DNM1 (0.31) DNM1TSHRLMNACA12CA1
SCHEMBL17691329 0.71 DNM1 (0.33) DNM1TSHRLMNACA12CA1
SCHEMBL17701560 0.71 DNM1 (0.33) DNM1TSHRLMNACA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240030026-A1 PROCESSING METHOD, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, PROCESSING APPARATUS, AND RECORDING MEDIUM Kokusai Electric Corporation (JP) 2024-01-25 US disclosed
CN-117121172-A Method for manufacturing semiconductor device, substrate processing method, substrate processing apparatus, and program 株式会社国际电气 2023-11-24 CN disclosed
WO-2022264430-A1 SEMICONDUCTOR DEVICE MANUFACTURING METHOD, SUBSTRATE PROCESSING METHOD, SUBSTRATE PROCESSING DEVICE, AND PROGRAM 株式会社KOKUSAI ELECTRIC 2022-12-22 WO disclosed
US-4671933-A Method for inhibiting corrosion of metal surfaces STAUFFER-WACKER SILICONES CORPORATION (US) 1987-06-09 US disclosed
US-4302571-A TERMINATED AT BOTH ENDS WITH SILANOIC HYDROXY GROUPS AND AN ORGANOSILANE OR ORGANOPOLYSILOXANE WITH HYDROLYZABLE GROUPS TO SERVE AS CROSSLINKING AGENTS SHIN-ETSU CHEMICAL CO., LTD. (JP) 1981-11-24 US disclosed