SCHEMBL28773752

SCHEMBL28773752

CCOC(CCNCCC(OCC)[SiH](OCC)OCC)[SiH](OCC)OCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL15327705 0.83
SCHEMBL557064 0.78 THRB (0.32)
SCHEMBL1818524 0.77 LMNA (0.35)
SCHEMBL444999 0.74
SCHEMBL21179216 0.72
SCHEMBL9958207 0.72 THRB (0.38)
SCHEMBL27970484 0.69
SCHEMBL28812819 0.68
SCHEMBL6623281 0.67 THRB (0.33)
SCHEMBL28425623 0.67 CA12 (0.37)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116897177-A Inorganic filler flowability modifier, resin composition containing inorganic filler, and molded article of the resin composition DIC株式会社 2023-10-17 CN disclosed
CN-109843981-B Polycarbonate imide resin and resin composition containing the same 东洋纺株式会社 2022-05-31 CN disclosed
CN-108368412-B Adhesive composition using polyamideimide resin 东洋纺株式会社 2020-12-22 CN disclosed