Acrylic Acid

Acrylic Acid

SCHEMBL2879710

C=CC(=O)O.OOO

nearest known ligand 0.00

Full drug profile on Sugi Atlas →

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acrylic Acid SCHEMBL28796440 0.89
Acrylic Acid SCHEMBL10482239 0.88 LMNA (1.00)
Acrylic Acid SCHEMBL5065665 0.88 LMNA (1.00)
Acrylic Acid SCHEMBL8460539 0.88 LMNA (1.00)
Acrylic Acid SCHEMBL8580358 0.88 LMNA (1.00)
Acrylic Acid SCHEMBL11652408 0.88 LMNA (1.00)
Acrylic Acid SCHEMBL4371336 0.88
Acrylic Acid SCHEMBL7706117 0.88 LMNA (1.00)
Acrylic Acid SCHEMBL8085498 0.88
Acrylic Acid SCHEMBL11252224 0.88 LMNA (1.00)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 41 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8192257-B2 Method of manufacture of constant groove depth pads MICRON TECHNOLOGY, INC. (US) 2012-06-05 US claimed
US-20070238297-A1 Method of manufacture of constant groove depth pads MICRON TECHNOLOGY, INC. (US) 2007-10-11 US claimed
CN-1059219-C A polymeric substrate containing polymeric microelements and methods of making and using the same RODEL INC (US) 2000-12-06 CN claimed
CN-1082567-A The polymeric substrate and the making and use method thereof that contain the polymerization microelements RODEL INC (US) 1994-02-23 CN claimed
US-4975487-A Vinylidine chloride interpolymer and a thermoplastic graft polymer THE DOW CHEMICAL COMPANY (US) 1990-12-04 US claimed
WO-2024084957-A1 POLISHING METHOD AND METHOD FOR PRODUCING SEMICONDUCTOR COMPONENT AGC株式会社 2024-04-25 WO disclosed
WO-2023190428-A1 POLISHING PAD, METHOD FOR PRODUCING POLISHING PAD, AND METHOD FOR POLISHING SURFACE OF OPTICAL MATERIAL OR SEMICONDUCTOR MATERIAL 富士紡ホールディングス株式会社 2023-10-05 WO disclosed
WO-2023182392-A1 POLISHING PAD AND METHOD FOR MANUFACTURING POLISHED WORKPIECE 富士紡ホールディングス株式会社 2023-09-28 WO disclosed
EP-4177008-A1 POLISHING PAD AND METHOD FOR PRODUCING POLISHED PRODUCT Fujibo Holdings, Inc. (JP) 2023-05-10 EP disclosed
WO-2022201254-A1 POLISHING PAD AND METHOD FOR MANUFACTURING POLISHED WORKPIECE 富士紡ホールディングス株式会社 2022-09-29 WO disclosed
US-20210347006-A1 POLISHING PAD AND METHOD FOR PRODUCING POLISHED PRODUCT FUJIBO HOLDINGS, INC. (JP) 2021-11-11 US disclosed
CN-113579992-A CMP pad construction with composite material properties using additive manufacturing process 应用材料公司 2021-11-02 CN disclosed
EP-0255345-A1 Liquid fuel compositions EXXON CHEMICAL PATENTS INC. (US) 1988-02-03 EP disclosed
WO-1987007216-A1 SEALABLE FILMS EXXON CHEMICAL PATENTS, INC. (US) 1987-12-03 WO disclosed
EP-0247896-A1 Sealable films EXXON CHEMICAL PATENTS INC. (US) 1987-12-02 EP disclosed
EP-0239320-A2 Liquid fuel compositions EXXON CHEMICAL PATENTS INC. (US) 1987-09-30 EP disclosed
EP-0177306-A2 Middle distillate fuel EXXON RESEARCH AND ENGINEERING COMPANY (US) 1986-04-09 EP disclosed
US-4155899-A MULTISTAGE, MUTLIZONAL; FILMS, COATING FABRICS OR MOLDINGS; BULK DENSITY HOOKER CHEMICALS & PLASTICS CORP. (US) 1979-05-22 US disclosed
US-4137216-A HIGH BULK DENSITY HOOKER CHEMICALS & PLASTICS CORP. (US) 1979-01-30 US disclosed
US-4028329-A Process for the bulk polymerization of vinyl halide polymers showing reduced reactor scale formation HOOKER CHEMICALS & PLASTICS CORPORATION (US) 1977-06-07 US disclosed