Predicted protein targets (top 15)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 16/20 | 0.60 |
| ▸ | FAAH | O00519 | 6/20 | 0.60 |
| ▸ | HSP90AA1 | P07900 | 3/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.50 |
| ▸ | PKM | P14618 | 1/20 | 0.50 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.50 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.50 |
| ▸ | DDAH1 | O94760 | 1/20 | 0.46 |
| ▸ | BCHE | P06276 | 1/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.44 |
| ▸ | LMNA | P02545 | 1/20 | 0.44 |
| ▸ | CCR6 | P51684 | 1/20 | 0.44 |
| ▸ | CACNA1B | Q00975 | 1/20 | 0.44 |
| ▸ | APBA1 | Q02410 | 1/20 | 0.44 |
| ▸ | APOBEC3G | Q9HC16 | 1/20 | 0.44 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2231333 | 0.88 | MGLL (0.52) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL1321309 | 0.80 | MGLL (0.83) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL19511560 | 0.80 | MGLL (0.83) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL21630074 | 0.80 | MGLL (0.83) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL95324 | 0.78 | MGLL (1.00) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL29065803 | 0.74 | MGLL (0.52) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL21993642 | 0.72 | MGLL (1.00) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL9719419 | 0.72 | MGLL (1.00) | MGLLFAAHHSP90AA1TDP1PKM | |
| SCHEMBL29190138 | 0.72 | MGLL (0.47) | MGLLFAAHHSP90AA1PKMALDH1A1 | |
| SCHEMBL10668708 | 0.72 | MGLL (0.75) | MGLLFAAHHSP90AA1TDP1PKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250132280-A1 | CHIP ATTACH FILM, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-04-24 | — | — | US | disclosed |
| CN-114901751-A | Thermosetting resin composition, prepreg, laminate, printed wiring board, and semiconductor package | 昭和电工材料株式会社 | 2022-08-12 | — | — | CN | disclosed |