Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28718337 | 0.72 | FAAH (0.41) | MCL1FAAH | |
| SCHEMBL11192235 | 0.72 | MCL1 (0.38) | MCL1FAAH | |
| SCHEMBL915166 | 0.71 | MCL1 (0.40) | MCL1FAAH | |
| SCHEMBL21012051 | 0.71 | MCL1 (0.36) | MCL1FAAH | |
| SCHEMBL4436655 | 0.70 | — | — | |
| SCHEMBL15085712 | 0.69 | — | — | |
| SCHEMBL18664154 | 0.69 | — | — | |
| SCHEMBL4277231 | 0.68 | KDM4E (0.33) | — | |
| SCHEMBL4654321 | 0.68 | — | — | |
| SCHEMBL1512966 | 0.66 | GRIK1 (0.47) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110117799-A | Copper foil with carrier | JX日矿日石金属株式会社 | 2019-08-13 | — | — | CN | disclosed |
| CN-104812944-B | Copper foil with carrier | JX日矿日石金属株式会社 | 2019-02-19 | — | — | CN | disclosed |
| CN-105980609-B | The manufacturing method of surface treatment copper foil, copper-cover laminated plate, printing distributing board, e-machine and printing distributing board | ＪＸ金属株式会社 | 2018-08-07 | — | — | CN | disclosed |
| CN-108277509-A | Copper foil with carrier | JX日矿日石金属株式会社 | 2018-07-13 | — | — | CN | disclosed |
| CN-104584699-B | Copper foil with carrier | JX日矿日石金属株式会社 | 2017-09-26 | — | — | CN | disclosed |
| CN-105980609-A | Treated surface copper foil, copper-clad laminate, printed wiring board, electronic device, and printed wiring board manufacturing method | ＪＸ金属株式会社 | 2016-09-28 | — | — | CN | disclosed |