SCHEMBL28839209

SCHEMBL28839209

[N-]=[N+]=Nc1cc(O)cc(C(=O)O)c1

nearest known ligand 0.56

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CA12 O43570 4/20 0.56
▸ CA1 P00915 4/20 0.56
▸ CA2 P00918 4/20 0.56
▸ CA9 Q16790 4/20 0.56
▸ CA7 P43166 3/20 0.56
▸ CA14 Q9ULX7 3/20 0.56
▸ HCAR1 Q9BXC0 3/20 0.47
▸ CA6 P23280 3/20 0.39
▸ ALDH1A1 P00352 3/20 0.39
▸ MAPT P10636 3/20 0.39
▸ CA5A P35218 3/20 0.39
▸ CA3 P07451 2/20 0.39
▸ CA4 P22748 2/20 0.39
▸ CA5B Q9Y2D0 2/20 0.39
▸ TP53 P04637 2/20 0.39
▸ HPGD P15428 2/20 0.39
▸ MAPK1 P28482 2/20 0.39
▸ TDP1 Q9NUW8 2/20 0.39
▸ KDM4E B2RXH2 1/20 0.39
▸ LMNA P02545 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL21348607 0.88 CA1 (0.41) CA12CA1CA2CA9CA7
SCHEMBL14729213 0.88 CA1 (0.41) CA12CA1CA2CA9CA7
SCHEMBL31574334 0.79 BACE1 (0.44) CA12CA1CA2CA9CA7
SCHEMBL13653935 0.76 MAOB (0.48) CA12CA1CA2CA9CA6
SCHEMBL29451102 0.75 CES2 (0.44) MAPT
SCHEMBL22834178 0.75 CES2 (0.44) MAPT
SCHEMBL16312302 0.75 CA1 (0.35) CA12CA1CA2CA9CA7
Hydrochloric Acid SCHEMBL28856154 0.74 MAOB (0.47) CA12CA1CA2CA9CA6
SCHEMBL22492181 0.74 HDAC1 (0.53) TSHR
SCHEMBL28083230 0.74 TP53 (0.52) CA12CA1CA2CA9CA7

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115074734-B Copper-reducing additive for aluminum substrate circuit board and preparation method and use method thereof 深圳市板明科技股份有限公司 2022-11-08 — — CN disclosed
CN-115074734-A Copper-reducing additive for aluminum substrate circuit board and preparation method and use method thereof 深圳市板明科技股份有限公司 2022-09-20 — — CN disclosed
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