SCHEMBL28845933

SCHEMBL28845933

C=Cc1ccc(COc2ccccc2-c2c(C)c(C)c(C)c(C)c2OCc2ccc(C=C)cc2)cc1

nearest known ligand 0.41

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.41
L3MBTL1 Q9Y468 2/20 0.41
MAPK1 P28482 1/20 0.41
TDP1 Q9NUW8 1/20 0.41
BRD4 O60885 5/20 0.40
PTGER1 P34995 2/20 0.39
RXRA P19793 2/20 0.36
RXRB P28702 2/20 0.36
RXRG P48443 2/20 0.36
APP P05067 1/20 0.35
KMT2A Q03164 2/20 0.34
KDM4E B2RXH2 1/20 0.34
PSMD14 O00487 1/20 0.34
ALDH1A1 P00352 1/20 0.34
HPGD P15428 1/20 0.34
CRHBP P24387 1/20 0.34
PPARG P37231 1/20 0.34
CRHR2 Q13324 1/20 0.34
CTDSP1 Q9GZU7 1/20 0.34
CCNB2 O95067 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29810178 1.00 MAPT (0.41) MAPTL3MBTL1MAPK1TDP1BRD4
SCHEMBL14755303 0.82 RXRA (0.46) MAPTL3MBTL1MAPK1TDP1BRD4
SCHEMBL6389116 0.76 MAPT (0.42) MAPTL3MBTL1MAPK1TDP1APP
SCHEMBL14655869 0.74 MAPT (0.39) MAPTL3MBTL1MAPK1TDP1PSMD14
SCHEMBL21116926 0.72 MAPT (0.34) MAPTL3MBTL1MAPK1TDP1KMT2A
SCHEMBL25594620 0.72 MAPT (0.32) MAPTL3MBTL1KDM4EALDH1A1NPC1
SCHEMBL14655816 0.71 ALDH1A1 (0.41) MAPTL3MBTL1APPPSMD14ALDH1A1
SCHEMBL29253386 0.71 MAPT (0.55) MAPTL3MBTL1MAPK1TDP1KMT2A
SCHEMBL8165407 0.70 RXRA (0.49) MAPTL3MBTL1MAPK1TDP1RXRA
SCHEMBL17328032 0.69 PTGS1 (0.47) MAPTL3MBTL1TDP1KMT2AKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115073907-A Resin composition, compound, prepreg, electric copper clad laminate, and preparation method and application thereof 成都科宜高分子科技有限公司 2022-09-20 CN claimed
CN-115073907-A Resin composition, compound, prepreg, electric copper clad laminate, and preparation method and application thereof 成都科宜高分子科技有限公司 2022-09-20 CN disclosed