⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2879063 | 0.92 | OPRM1 (0.46) | — | |
| SCHEMBL16180409 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL5517576 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL11791050 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL11046060 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL2341453 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL3627083 | 0.90 | OPRM1 (0.44) | — | |
| SCHEMBL2886080 | 0.82 | — | — | |
| SCHEMBL9475851 | 0.78 | — | — | |
| SCHEMBL3212565 | 0.77 | DNM1 (0.41) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-7652118-B2 | Polycarbosilane and method for producing same | TOAGOSEI CO., LTD. (JP) | 2010-01-26 | — | — | US | claimed |
| EP-2128897-B1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LTD (JP) | 2015-05-06 | — | — | EP | disclosed |
| US-8716209-B2 | Agent for post-etch treatment of silicon dielectric film, method of manufacturing semiconductor device, and semiconductor device | FUJITSU LIMITED (JP) | 2014-05-06 | — | — | US | disclosed |
| US-8299185-B2 | Curable cage-type silicone copolymer and process for production thereof and curable resin composition comprising curable cage-type silicone copolymer and cured product thereof | NIPPON STEEL CHEMICAL CO., LTD. (JP) | 2012-10-30 | — | — | US | disclosed |
| EP-2024439-B1 | CURABLE SILICONE RESIN COMPOSITION AND CURED BODY THEREOF | DOW CORNING TORAY CO LTD (JP) | 2012-06-27 | — | — | EP | disclosed |
| US-20100280190-A1 | CURABLE CAGE-TYPE SILICONE COPOLYMER AND PROCESS FOR PRODUCTION THEREOF AND CURABLE RESIN COMPOSITION COMPRISING CURABLE CAGE-TYPE SILICONE COPOLYMER AND CURED PRODUCT THEREOF | NIPPON STEEL CHEMICAL & MATERIAL CO., LTD. (JP) | 2010-11-04 | — | — | US | disclosed |
| US-7652118-B2 | Polycarbosilane and method for producing same | TOAGOSEI CO., LTD. (JP) | 2010-01-26 | — | — | US | disclosed |
| US-20100007031-A1 | AGENT FOR POST-ETCH TREATMENT OF SILICON DIELECTRIC FILM, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | FUJITSU LIMITED (JP) | 2010-01-14 | — | — | US | disclosed |
| US-20090298980-A1 | Curable Silicone Resin Composition and Cured Body Thereof | DOW CORNING TORAY CO., LTD. (JP) | 2009-12-03 | — | — | US | disclosed |
| EP-2128897-A1 | SILICON DIELECTRIC TREATING AGENT FOR USE AFTER ETCHING, PROCESS FOR PRODUCING SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR DEVICE | Fujitsu Limited (JP) | 2009-12-02 | — | — | EP | disclosed |
| US-20050037274-A1 | Electrophotographic photoreceptor, process cartridge, image forming apparatus and image forming method | KONICA MINOLTA BUSINESS TECHNOLOGIES, INC. (JP) | 2005-02-17 | — | — | US | disclosed |
| US-20040249103-A1 | Silsesquioxane derivatives and process for production thereof | JNC CORPORATION (JP) | 2004-12-09 | — | — | US | disclosed |
| US-6797444-B2 | A PROTECTIVE LAYER CONTAINING A COUPLING FLUOROPOLYMER PARTICLES DISPERSED IN A COPOLYMER HAVING A FLUORINE ATOM-CONTAINING SILOXANE ADDITION-CONDENSATION PRODUCT IN A SIDE CHAIN; NONABRASIVE, HARDENING | KONICA CORPORATION (JP) | 2004-09-28 | — | — | US | disclosed |
| EP-1428795-A1 | SILSESQUIOXANE DERIVATIVES AND PROCESS FOR PRODUCTION THEREOF | CHISSO CORPORATION (JP) | 2004-06-16 | — | — | EP | disclosed |
| US-20030134209-A1 | Electrophotographic photoreceptor and production method of the same | KONICA CORPORATION (JP) | 2003-07-17 | — | — | US | disclosed |
| US-20030134130-A1 | Modified silica compositions, transparent resin compositions and thermoplastic resin laminates and automotive parts formed therefrom, and production method thereof | NISSAN MOTOR CO., LTD. | 2003-07-17 | — | — | US | disclosed |
| US-6569586-B2 | Comprises photosensitive layer and resin layer including organic polymer, siloxane component, and charge transfer component; durability | KONICA CORPORATION (JP) | 2003-05-27 | — | — | US | disclosed |
| US-20020076631-A1 | Photoreceptor for forming electrostatic latent image | KONICA CORPORATION (JP) | 2002-06-20 | — | — | US | disclosed |
| US-5965663-A | POLYARYLENE POLYETHER WITH CROSSLINKABLE UNSATURATED ENDGROUPS AND LOW CHLORINE AND ALKALI METAL CONTENT; FILLER; AND A COMPOUND OF MOLECULAR WEIGHT 5000 OR LESS HAVING AN UNSATURATED LINKAGE; MOLDABILTY, NON-HYGROSCOPIC | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-10-12 | — | — | US | disclosed |
| US-5622784-A | WATERPROOFING; MODIFIED SILICON DIOXIDE THIN FILM | SEIKO EPSON CORPORATION (JP) | 1997-04-22 | — | — | US | disclosed |