Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.47 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.46 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.44 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28262735 | 0.82 | TSHR (0.50) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL28730387 | 0.82 | ALDH1A1 (0.32) | TSHRALDH1A1MAPK1 | |
| SCHEMBL28419444 | 0.82 | ALDH1A1 (0.43) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL28433672 | 0.82 | ALDH1A1 (0.43) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL16390481 | 0.80 | SMN1; SMN2 (0.58) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL16424051 | 0.79 | SMN1; SMN2 (0.66) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL16423693 | 0.79 | SMN1; SMN2 (0.61) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL231272 | 0.79 | ALDH1A1 (0.35) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL16424050 | 0.78 | ALDH1A1 (0.65) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL15647384 | 0.77 | TSHR (0.55) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115023801-A | Method for peeling semiconductor chip with protective film | 琳得科株式会社 | 2022-09-06 | — | — | CN | disclosed |
| CN-114981928-A | Method for peeling adherend | 琳得科株式会社 | 2022-08-30 | — | — | CN | disclosed |