SCHEMBL28857182

SCHEMBL28857182

C=C(CC=Cc1ccccc1)C(=O)O.C=C=C

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PAM P19021 2/20 0.59
MAOB P27338 4/20 0.50
HAO1 Q9UJM8 1/20 0.42
MAOA P21397 3/20 0.41
HDAC1 Q13547 3/20 0.41
ALDH1A1 P00352 2/20 0.41
HDAC3 O15379 2/20 0.41
HDAC4 P56524 2/20 0.41
HDAC2 Q92769 2/20 0.41
HDAC8 Q9BY41 2/20 0.41
HDAC6 Q9UBN7 2/20 0.41
TNKS O95271 1/20 0.41
HCAR2 Q8TDS4 1/20 0.41
HDAC7 Q8WUI4 1/20 0.41
HDAC10 Q969S8 1/20 0.41
HDAC11 Q96DB2 1/20 0.41
TNKS2 Q9H2K2 1/20 0.41
HDAC9 Q9UKV0 1/20 0.41
HDAC5 Q9UQL6 1/20 0.41
PLIN1 O60240 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16463 0.95 PAM (0.66) PAMMAOBHAO1MAOAHDAC1
Benzene SCHEMBL27612926 0.95 PAM (0.66) PAMMAOBHAO1MAOAHDAC1
SCHEMBL278485 0.95 PAM (0.66) PAMMAOBHAO1MAOAHDAC1
Bicarbonate SCHEMBL4654852 0.93 PAM (0.63) PAMMAOBHAO1MAOAHDAC1
Ethylene SCHEMBL28169506 0.93 PAM (0.63) PAMMAOBHAO1MAOAHDAC1
Butadiene SCHEMBL5146753 0.90 PAM (0.59) PAMMAOBHAO1MAOAHDAC1
Maleic Acid SCHEMBL8841066 0.88 PAM (0.58) PAMMAOBHAO1MAOAHDAC1
Methacrylic Acid SCHEMBL5875035 0.88 PAM (0.58) PAMMAOBHAO1MAOAHDAC1
SCHEMBL28352099 0.88 PAM (0.58) PAMMAOBHAO1MAOAHDAC1
Propene SCHEMBL28752256 0.88 PAM (0.58) PAMMAOBHAO1MAOAHDAC1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-105047540-B Anti-reflecting layer and method 台湾积体电路制造股份有限公司 2018-05-25 CN disclosed
CN-104752171-B gap filling material and method 台湾积体电路制造股份有限公司 2018-02-27 CN disclosed