SCHEMBL28867290

SCHEMBL28867290

CCCCCCCCCCCCCCCCCCCCCCOC(=O)OOC(=O)O

nearest known ligand 0.53

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.53
HCAR2 Q8TDS4 2/20 0.50
EPHX1 P07099 1/20 0.50
TSHR P16473 3/20 0.48
RAD52 P43351 1/20 0.46
NPSR1 Q6W5P4 1/20 0.46
ALDH1A1 P00352 2/20 0.44
FAAH O00519 1/20 0.44
LMNA P02545 1/20 0.44
ACHE P22303 6/20 0.44
DGKA P23743 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14152423 1.00 NAAA (0.53) NAAAHCAR2EPHX1TSHRRAD52
SCHEMBL2466919 1.00 NAAA (0.53) NAAAHCAR2EPHX1TSHRRAD52
SCHEMBL4631146 1.00 NAAA (0.53) NAAAHCAR2EPHX1TSHRRAD52
SCHEMBL8663178 1.00 NAAA (0.53) NAAAHCAR2EPHX1TSHRRAD52
SCHEMBL8157911 1.00 NAAA (0.53) NAAAHCAR2EPHX1TSHRRAD52
SCHEMBL3703728 1.00 NAAA (0.53) NAAAHCAR2EPHX1TSHRRAD52
SCHEMBL28099915 1.00 NAAA (0.53) NAAAHCAR2EPHX1TSHRRAD52
SCHEMBL2059472 0.98 NAAA (0.50) NAAAHCAR2EPHX1TSHRRAD52
SCHEMBL669573 0.92 ALDH1A1 (0.52) NAAAHCAR2EPHX1TSHRALDH1A1
SCHEMBL631624 0.92 NAAA (0.61) NAAAHCAR2EPHX1TSHRRAD52

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117924788-A Thermal expansion microsphere and preparation method thereof 万华化学集团股份有限公司 2024-04-26 CN claimed
CN-116120694-A Thermal expansion microsphere with core-shell structure and preparation method thereof 万华化学集团股份有限公司 2023-05-16 CN claimed
CN-111253657-B Conductive crosslinked polyethylene composite material and preparation method thereof 浙江瑞堂塑料科技股份有限公司 2022-10-21 CN claimed
CN-111253657-A Conductive crosslinked polyethylene composite material and preparation method thereof 浙江瑞堂塑料科技股份有限公司 2020-06-09 CN claimed
CN-117924788-A Thermal expansion microsphere and preparation method thereof 万华化学集团股份有限公司 2024-04-26 CN disclosed
CN-116120694-A Thermal expansion microsphere with core-shell structure and preparation method thereof 万华化学集团股份有限公司 2023-05-16 CN disclosed
CN-111253657-B Conductive crosslinked polyethylene composite material and preparation method thereof 浙江瑞堂塑料科技股份有限公司 2022-10-21 CN disclosed
CN-111253657-A Conductive crosslinked polyethylene composite material and preparation method thereof 浙江瑞堂塑料科技股份有限公司 2020-06-09 CN disclosed