⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9501488 | 0.84 | F2RL1 (0.46) | — | |
| SCHEMBL321153 | 0.80 | — | — | |
| SCHEMBL27550578 | 0.80 | — | — | |
| SCHEMBL23863035 | 0.80 | — | — | |
| SCHEMBL7868086 | 0.79 | ALDH1A1 (0.40) | — | |
| SCHEMBL3294810 | 0.79 | — | — | |
| Hydrochloric Acid SCHEMBL11544931 | 0.78 | ADRA2A (0.45) | — | |
| SCHEMBL5353787 | 0.78 | ALDH1A1 (0.43) | — | |
| SCHEMBL395971 | 0.77 | — | — | |
| SCHEMBL29129483 | 0.77 | F2RL1 (0.36) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 133 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-107428914-B | Epoxy resin composition | NISSHINBO CHEMICAL INC. (JP) | 2019-11-01 | — | — | CN | claimed |
| CN-109957286-A | Ink and its preparation method and application | 深圳市百柔新材料技术有限公司 | 2019-07-02 | — | — | CN | claimed |
| CN-107428914-A | Epoxy resin composition | 日清纺化学株式会社 | 2017-12-01 | — | — | CN | claimed |
| CN-107365439-A | A kind of new neoprene vulcanization process | 华南理工大学 | 2017-11-21 | — | — | CN | claimed |
| CN-104194271-B | Dielectric composite material for fingerprint sensor induction layer and preparation method thereof | 天津德高化成新材料股份有限公司 | 2016-08-17 | — | — | CN | claimed |
| CN-105693141-A | Method for preparing dielectric composite material for induction layer of fingerprint sensor | 天津德高化成新材料股份有限公司 | 2016-06-22 | — | — | CN | claimed |
| EP-1051401-B1 | PROCESS FOR THE PRODUCTION OF FORMYLIMIDAZOLES | LONZA AG (CH) | 2007-10-24 | — | — | EP | claimed |
| EP-0913394-B1 | Process for the production of formylimidazoles | LONZA AG (CH) | 2005-12-21 | — | — | EP | claimed |
| EP-0916659-B1 | Process for the preparation of formylimidazoles | LONZA AG (CH) | 2002-05-29 | — | — | EP | claimed |
| US-4472581-A | Imidazomethylene dyes | BASF AKTIENGESELLSCHAFT (DE) | 1984-09-18 | — | — | US | claimed |
| JP-4316538-A | — | — | None | — | — | JP | disclosed |
| CN-121555065-A | Preparation method of water-based polyurethane fireproof paint | 南通宝利来涂料有限公司 | 2026-02-24 | — | — | CN | disclosed |
| CN-120505032-B | Preparation process of water-based polyurethane fireproof paint | 南通宝利来涂料有限公司 | 2025-12-23 | — | — | CN | disclosed |
| CN-120505032-A | Preparation process of water-based polyurethane fireproof paint | 南通宝利来涂料有限公司 | 2025-08-19 | — | — | CN | disclosed |
| US-20250011635-A1 | ADHESIVE PARTICLES AND LAMINATE | SEKISUI CHEMICAL CO., LTD. (JP) | 2025-01-09 | — | — | US | disclosed |
| WO-1990000802-A1 | INSULATING TAPE FOR MAKING AN INSULATING SHEATH IMPREGNATED WITH A HEAT-CURING EPOXIDE RESIN/ACID ANHYDRIDE MIXTURE FOR ELECTRICAL CONDUCTORS | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-01-25 | — | — | WO | disclosed |
| EP-0033295-B1 | INSULATING TAPE FOR THE MANUFACTURE OF AN INSULATING JACKET FOR ELECTRIC CONDUCTORS IMPREGNATED WITH A THERMOSETTING CURING MIXTURE OF EPOXY RESIN AND ACID ANHYDRIDE | SIEMENS AKTIENGESELLSCHAFT (DE) | 1987-07-15 | — | — | EP | disclosed |
| EP-0216386-A2 | Process for the preparation of hydroxymethylimidazoles | BASF Aktiengesellschaft (DE) | 1987-04-01 | — | — | EP | disclosed |
| EP-0102916-A2 | Insulating tape based on a thermosetting epoxy resin and an acid anhydride for the impregnation of an insulator for electrical conductors | SIEMENS AKTIENGESELLSCHAFT (DE) | 1984-03-14 | — | — | EP | disclosed |
| EP-0033295-A2 | Insulating tape for the manufacture of an insulating jacket for electric conductors impregnated with a thermosetting curing mixture of epoxy resin and acid anhydride | SIEMENS AKTIENGESELLSCHAFT (DE) | 1981-08-05 | — | — | EP | disclosed |