SCHEMBL28879893

SCHEMBL28879893

OCc1ccc(I)cc1I

nearest known ligand 0.39

Predicted protein targets (top 9)

geneUniProtsupporting neighboursconfidence
IDO1 P14902 3/20 0.39
SLC6A4 P31645 5/20 0.39
SLC6A2 P23975 4/20 0.38
TTR P02766 1/20 0.36
TP53 P04637 1/20 0.32
ERN1 O75460 1/20 0.31
TYR P14679 1/20 0.31
CYP3A4 P08684 1/20 0.30
APOBEC3G Q9HC16 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL6156516 0.82 SLC6A4 (0.43) IDO1SLC6A4SLC6A2ERN1TYR
SCHEMBL22288324 0.81 HTR2C (0.35) IDO1SLC6A4TTRTYR
SCHEMBL28879920 0.80 SLC6A4 (0.42) IDO1SLC6A4SLC6A2TTRTP53
SCHEMBL4290170 0.78 TYR (0.39) IDO1SLC6A4SLC6A2TP53ERN1
SCHEMBL17151862 0.78 EGFR (0.43) SLC6A4SLC6A2TTRTP53
SCHEMBL18243053 0.77 IDO1 (0.36) IDO1SLC6A4SLC6A2TTRERN1
SCHEMBL283006 0.77 IDO1 (0.36) IDO1SLC6A4SLC6A2TTR
SCHEMBL23680033 0.76 IDO1 (0.41) IDO1SLC6A4SLC6A2TP53TYR
SCHEMBL1197989 0.76 IDO1 (0.41) IDO1SLC6A4CYP3A4
SCHEMBL15196307 0.76 TRPA1 (0.36) TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122070309-A Composition, resin composition, film-forming composition for lithography, and resist film-forming composition 三菱瓦斯化学株式会社 2026-05-19 CN disclosed
WO-2025079631-A1 COMPOSITION, RESIN COMPOSITION, COMPOSITION FOR FILM FORMATION, COMPOSITION FOR FORMING LITHOGRAPHIC FILM, AND COMPOSITION FOR FORMING RESIST FILM 三菱瓦斯化学株式会社 2025-04-17 WO disclosed
CN-114956933-A Marker containing isotope oxygen atom and preparation method and application thereof 清华大学 2022-08-30 CN disclosed