SCHEMBL28894533

SCHEMBL28894533

Cc1cccc2cc3ccccc3c(OC(=O)C3CCCCC3C(=O)O)c12

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 2/20 0.44
▸ ALDH1A1 P00352 4/20 0.43
▸ LMNA P02545 2/20 0.38
▸ GAA P10253 1/20 0.37
▸ EPHX1 P07099 1/20 0.37
▸ RAB9A P51151 2/20 0.35
▸ L3MBTL1 Q9Y468 2/20 0.35
▸ MEN1 O00255 1/20 0.35
▸ KMT2A Q03164 1/20 0.35
▸ TSHR P16473 1/20 0.35
▸ RECQL P46063 1/20 0.35
▸ HSD17B10 Q99714 1/20 0.35
▸ MAPT P10636 1/20 0.35
▸ TAS1R3 Q7RTX0 1/20 0.34
▸ TAS1R1 Q7RTX1 1/20 0.34
▸ TAS1R2 Q8TE23 1/20 0.34
▸ CNR1 P21554 1/20 0.34
▸ CNR2 P34972 1/20 0.34
▸ CCR1 P32246 1/20 0.34
▸ RXFP1 Q9HBX9 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28894857 0.92 KDM4E (0.42) KDM4EALDH1A1LMNAGAARAB9A
SCHEMBL28894336 0.90 KDM4E (0.44) KDM4EALDH1A1LMNAGAAEPHX1
SCHEMBL29963416 0.87 KDM4E (0.41) KDM4EALDH1A1LMNAGAARAB9A
SCHEMBL28894708 0.87 ALDH1A1 (0.43) KDM4EALDH1A1LMNAEPHX1RAB9A
SCHEMBL28894490 0.87 KDM4E (0.49) KDM4EALDH1A1LMNAGAAEPHX1
SCHEMBL29963396 0.87 KDM4E (0.49) KDM4EALDH1A1LMNAGAAEPHX1
SCHEMBL28894631 0.86 POLB (0.39) KDM4EALDH1A1LMNAGAARAB9A
SCHEMBL29963343 0.86 KDM4E (0.41) KDM4EALDH1A1LMNAGAARAB9A
SCHEMBL28894689 0.86 KDM4E (0.41) KDM4EALDH1A1LMNAGAAEPHX1
SCHEMBL29963246 0.83 KDM4E (0.42) KDM4EALDH1A1LMNAGAAEPHX1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380075-B Epoxy resin composition for sealing semiconductor 纳美仕有限公司 2024-06-18 — — CN disclosed
CN-115380075-A Epoxy resin composition for semiconductor encapsulation 纳美仕有限公司 2022-11-22 — — CN disclosed
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