SCHEMBL29963246

SCHEMBL29963246

Cc1ccc2c(OC(=O)C3CCCCC3C(=O)O)c3ccccc3cc2c1

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ KDM4E B2RXH2 3/20 0.42
▸ ALDH1A1 P00352 2/20 0.41
▸ LMNA P02545 2/20 0.41
▸ GLA P06280 1/20 0.40
▸ EPHX1 P07099 1/20 0.37
▸ HSD17B10 Q99714 2/20 0.36
▸ TSHR P16473 1/20 0.36
▸ RECQL P46063 1/20 0.36
▸ RXFP1 Q9HBX9 1/20 0.35
▸ TP53 P04637 1/20 0.35
▸ GAA P10253 2/20 0.35
▸ RAB9A P51151 2/20 0.35
▸ MEN1 O00255 1/20 0.35
▸ PKM P14618 1/20 0.35
▸ KMT2A Q03164 1/20 0.35
▸ FNTA P49354 1/20 0.34
▸ FNTB P49356 1/20 0.34
▸ POLB P06746 1/20 0.34
▸ HPGD P15428 1/20 0.34
▸ MAPT P10636 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28894332 1.00 KDM4E (0.42) KDM4EALDH1A1LMNAGLAEPHX1
SCHEMBL28895037 0.93 KDM4E (0.42) KDM4EALDH1A1LMNAGLAEPHX1
SCHEMBL28894804 0.92 GLA (0.41) KDM4EALDH1A1LMNAGLAGAA
SCHEMBL29963396 0.90 KDM4E (0.49) KDM4EALDH1A1LMNAGLAEPHX1
SCHEMBL28894490 0.90 KDM4E (0.49) KDM4EALDH1A1LMNAGLAEPHX1
SCHEMBL29963307 0.88 LMNA (0.44) KDM4EALDH1A1LMNAGLAHSD17B10
SCHEMBL29963377 0.88 LMNA (0.44) KDM4EALDH1A1LMNAGLAHSD17B10
SCHEMBL29963386 0.86 ALDH1A1 (0.39) KDM4EALDH1A1LMNAHSD17B10TSHR
SCHEMBL28895030 0.86 ALDH1A1 (0.39) KDM4EALDH1A1LMNAHSD17B10TSHR
SCHEMBL28894515 0.85 KDM4E (0.40) KDM4EALDH1A1LMNAEPHX1HSD17B10

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380075-B Epoxy resin composition for sealing semiconductor 纳美仕有限公司 2024-06-18 — — CN disclosed
CN-115380075-A Epoxy resin composition for semiconductor encapsulation 纳美仕有限公司 2022-11-22 — — CN disclosed
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