SCHEMBL28894624

SCHEMBL28894624

O=C(O)C1CC=CCC1C(=O)Oc1c2ccccc2cc2ccccc12

nearest known ligand 0.43

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ HSD17B10 Q99714 4/20 0.43
▸ TSHR P16473 2/20 0.43
▸ POLB P06746 6/20 0.43
▸ TDP1 Q9NUW8 4/20 0.43
▸ GAA P10253 3/20 0.41
▸ SMN1; SMN2 Q16637 2/20 0.41
▸ ALDH1A1 P00352 7/20 0.40
▸ KMT2A Q03164 7/20 0.40
▸ MEN1 O00255 4/20 0.40
▸ KDM4E B2RXH2 3/20 0.40
▸ HPGD P15428 2/20 0.40
▸ CYP1A2 P05177 1/20 0.40
▸ GLA P06280 1/20 0.40
▸ CYP2C19 P33261 1/20 0.40
▸ TAAR1 Q96RJ0 1/20 0.39
▸ HTT P42858 2/20 0.37
▸ MAPT P10636 1/20 0.37
▸ NPY1R P25929 1/20 0.37
▸ HIF1A Q16665 1/20 0.37
▸ L3MBTL1 Q9Y468 2/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28959712 0.90 ALDH1A1 (0.39) HSD17B10TSHRPOLBTDP1GAA
SCHEMBL29963386 0.90 ALDH1A1 (0.39) HSD17B10TSHRPOLBTDP1GAA
SCHEMBL28895030 0.90 ALDH1A1 (0.39) HSD17B10TSHRPOLBTDP1GAA
SCHEMBL28894713 0.90 TSHR (0.49) HSD17B10TSHRPOLBTDP1GAA
SCHEMBL28894711 0.88 POLB (0.40) HSD17B10TSHRPOLBTDP1GAA
SCHEMBL28894692 0.87 ALDH1A1 (0.43) HSD17B10TSHRPOLBTDP1GAA
SCHEMBL29962997 0.87 KMT2A (0.41) HSD17B10TSHRPOLBTDP1GAA
SCHEMBL28894518 0.87 ALDH1A1 (0.43) HSD17B10TSHRPOLBTDP1GAA
SCHEMBL29963602 0.87 ALDH1A1 (0.43) HSD17B10TSHRPOLBTDP1GAA
SCHEMBL28894468 0.87 ALDH1A1 (0.43) HSD17B10TSHRPOLBTDP1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380075-B Epoxy resin composition for sealing semiconductor 纳美仕有限公司 2024-06-18 — — CN disclosed
CN-115380075-A Epoxy resin composition for semiconductor encapsulation 纳美仕有限公司 2022-11-22 — — CN disclosed
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