SCHEMBL29963602

SCHEMBL29963602

CCc1ccc2c(OC(=O)C3CC=CCC3C(=O)O)c3ccccc3cc2c1

nearest known ligand 0.43

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
▸ ALDH1A1 P00352 2/20 0.43
▸ HSD17B10 Q99714 3/20 0.40
▸ TSHR P16473 3/20 0.40
▸ CYP1A2 P05177 1/20 0.38
▸ CYP2A6 P11509 1/20 0.38
▸ POLB P06746 6/20 0.36
▸ GAA P10253 2/20 0.36
▸ TAAR1 Q96RJ0 1/20 0.36
▸ TDP1 Q9NUW8 4/20 0.36
▸ KDM4E B2RXH2 1/20 0.36
▸ RAB9A P51151 1/20 0.35
▸ AKR1B1 P15121 1/20 0.35
▸ KMT2A Q03164 1/20 0.34
▸ TP53 P04637 1/20 0.34
▸ SMN1; SMN2 Q16637 1/20 0.33
▸ L3MBTL1 Q9Y468 1/20 0.33
▸ ENPP2 Q13822 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28894468 1.00 ALDH1A1 (0.43) ALDH1A1HSD17B10TSHRCYP1A2CYP2A6
SCHEMBL28894692 0.94 ALDH1A1 (0.43) ALDH1A1HSD17B10TSHRCYP1A2CYP2A6
SCHEMBL28894816 0.92 ALDH1A1 (0.44) ALDH1A1HSD17B10TSHRCYP1A2CYP2A6
SCHEMBL28894526 0.89 ALDH1A1 (0.46) ALDH1A1HSD17B10TSHRPOLBGAA
SCHEMBL29963392 0.89 ALDH1A1 (0.46) ALDH1A1HSD17B10TSHRPOLBGAA
SCHEMBL28894624 0.87 HSD17B10 (0.43) ALDH1A1HSD17B10TSHRCYP1A2POLB
SCHEMBL29963577 0.87 KDM4E (0.42) ALDH1A1HSD17B10TSHRCYP1A2CYP2A6
SCHEMBL28894879 0.87 KDM4E (0.42) ALDH1A1HSD17B10TSHRCYP1A2CYP2A6
SCHEMBL28895043 0.87 POLB (0.39) ALDH1A1CYP1A2CYP2A6POLBTDP1
SCHEMBL28894802 0.85 ALDH1A1 (0.49) ALDH1A1HSD17B10TSHRPOLBGAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115380075-B Epoxy resin composition for sealing semiconductor 纳美仕有限公司 2024-06-18 — — CN disclosed
CN-115380075-A Epoxy resin composition for semiconductor encapsulation 纳美仕有限公司 2022-11-22 — — CN disclosed
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