Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | LMNA | P02545 | 2/20 | 0.59 |
| ▸ | TSHR | P16473 | 1/20 | 0.34 |
| ▸ | CYP2D6 | P10635 | 2/20 | 0.31 |
| ▸ | SPHK1 | Q9NYA1 | 1/20 | 0.31 |
| ▸ | GMNN | O75496 | 1/20 | 0.31 |
| ▸ | POLB | P06746 | 1/20 | 0.31 |
| ▸ | THPO | P40225 | 1/20 | 0.31 |
| ▸ | MTOR | P42345 | 1/20 | 0.31 |
| ▸ | BLM | P54132 | 1/20 | 0.31 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.31 |
| ▸ | TP53 | P04637 | 1/20 | 0.31 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.31 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.31 |
| ▸ | MAPT | P10636 | 1/20 | 0.31 |
| ▸ | CETP | P11597 | 1/20 | 0.31 |
| ▸ | HTT | P42858 | 1/20 | 0.31 |
| ▸ | UBE2N | P61088 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29963858 | 0.89 | LMNA (0.48) | LMNATSHR | |
| SCHEMBL18759639 | 0.83 | LMNA (0.41) | LMNA | |
| SCHEMBL29347459 | 0.83 | LMNA (0.41) | LMNA | |
| SCHEMBL18239485 | 0.80 | LMNA (0.36) | LMNATSHR | |
| SCHEMBL8561000 | 0.80 | LMNA (0.36) | LMNATSHR | |
| SCHEMBL2386591 | 0.80 | LMNA (0.36) | LMNATSHR | |
| SCHEMBL9203322 | 0.79 | LMNA (0.80) | LMNATSHRCYP2D6SPHK1GMNN | |
| SCHEMBL9289219 | 0.78 | LMNA (0.38) | LMNATSHR | |
| SCHEMBL8757790 | 0.77 | LMNA (0.76) | LMNATSHRCYP2D6SPHK1GMNN | |
| Ethohexadiol SCHEMBL6282991 | 0.75 | LMNA (1.00) | LMNATSHRCYP2D6SPHK1GMNN |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 21 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115229381-A | Lead-free solder material, layer structure, method of forming solder material and layer structure | 英飞凌科技股份有限公司 | 2022-10-25 | — | — | CN | claimed |
| US-5176759-A | 2-alkyl-1,3-hexanediol | SENJU METAL INDUSTRY CO., LTD. (JP) | 1993-01-05 | — | — | US | claimed |
| CN-115229381-A | Lead-free solder material, layer structure, method of forming solder material and layer structure | 英飞凌科技股份有限公司 | 2022-10-25 | — | — | CN | disclosed |
| CN-110970149-B | Resin composition for forming electrode, chip-type electronic component, and method for producing same | 京瓷株式会社 | 2021-09-28 | — | — | CN | disclosed |
| CN-110970149-A | Resin composition for forming electrode, chip-type electronic component, and method for producing same | 京瓷株式会社 | 2020-04-07 | — | — | CN | disclosed |
| EP-2038086-B1 | NO-CLEAN LOW-RESIDUE SOLDER PASTE FOR SEMICONDUCTOR DEVICE APPLICATIONS | HERAEUS DEUTSCHLAND GMBH & CO KG (DE) | 2015-02-25 | — | — | EP | disclosed |
| US-7767032-B2 | alloy powder dispersed in a flux mixture comprising a low amount of rosin in combination with a viscous solvent system, thixotropic agents, activators, additives and optionally plasticizers; for die-attach dispensing or fine pitch printing; homogeneity; without prior cleaning | W.C. Heraeus Holding GmbH (DE) | 2010-08-03 | — | — | US | disclosed |
| EP-2038086-A1 | NO-CLEAN LOW-RESIDUE SOLDER PASTE FOR SEMICONDUCTOR DEVICE APPLICATIONS | Umicore AG & Co. KG (DE) | 2009-03-25 | — | — | EP | disclosed |
| US-20080000549-A1 | No-clean low-residue solder paste for semiconductor device applications | UMICORE AG & CO. KG (DE) | 2008-01-03 | — | — | US | disclosed |
| WO-2008000349-A1 | NO-CLEAN LOW-RESIDUE SOLDER PASTE FOR SEMICONDUCTOR DEVICE APPLICATIONS | UMICORE AG & CO. KG (DE) | 2008-01-03 | — | — | WO | disclosed |
| US-6651870-B2 | Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate | KABUSHIKI KAISHA TOSHIBA (JP) | 2003-11-25 | — | — | US | disclosed |
| US-6457632-B1 | Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy | KABUSHIKI KAISHA TOSHIBA (JP) | 2002-10-01 | — | — | US | disclosed |
| EP-0875331-B1 | Method of bonding an electronic part to a substrate. | TOSHIBA KK (JP) | 2001-11-21 | — | — | EP | disclosed |
| US-6280858-B1 | SUBSTRATE WITH ELECTROCONDUCTIVE BONDING MEMBER AND SOLDER ALLOY | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-08-28 | — | — | US | disclosed |
| US-6220501-B1 | METALLIC SUBSTRATES ARE COATED WITH AN UNDERCOAT ALLOY OF TIN AND ZINC AND CONTACTED WITH EACH OTHER THROUGH A MIXTURE CONTAINING ZINC AND TIN AND FLUX, HEATING SUBSTRATE TO MELT THE SOLDER, SOLIDIFIFYING TO JOIN METALLIC MEMBER | KABUSHIKI KAISHA TOSHIBA (JP) | 2001-04-24 | — | — | US | disclosed |
| EP-0875331-A2 | Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate | KABUSHIKI KAISHA TOSHIBA (JP) | 1998-11-04 | — | — | EP | disclosed |
| US-5176759-A | 2-alkyl-1,3-hexanediol | SENJU METAL INDUSTRY CO., LTD. (JP) | 1993-01-05 | — | — | US | disclosed |
| US-5176759-A | 2-alkyl-1,3-hexanediol | SENJU METAL INDUSTRY CO., LTD. (JP) | 1993-01-05 | — | — | US | disclosed |
| US-4894406-A | 2-ALKYL-1,3-HEXANEDIOL ALKYL ESTERS | EASTMAN KODAK COMPANY (US) | 1990-01-16 | — | — | US | disclosed |
| US-3915936-A | Process for the production of unsaturated polyester resins | DYNAMIT NOBEL AG | 1975-10-28 | — | — | US | disclosed |