Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SLC2A1 | P11166 | 1/20 | 0.35 |
| ▸ | RIPK1 | Q13546 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 2/20 | 0.32 |
| ▸ | NPC1 | O15118 | 1/20 | 0.32 |
| ▸ | HPGD | P15428 | 1/20 | 0.32 |
| ▸ | RAB9A | P51151 | 1/20 | 0.32 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.32 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29145325 | 0.89 | MAPT (0.35) | MAPTNPC1HPGDRAB9ASMN1; SMN2 | |
| SCHEMBL27444996 | 0.86 | MAPT (0.36) | RIPK1MAPTNPC1RAB9ASMN1; SMN2 | |
| SCHEMBL27641557 | 0.81 | MAPT (0.36) | MAPTNPC1HPGDRAB9ASMN1; SMN2 | |
| SCHEMBL27547767 | 0.80 | NPC1 (0.38) | MAPTNPC1HPGDRAB9ASMN1; SMN2 | |
| SCHEMBL17818209 | 0.76 | MAPT (0.48) | MAPTNPC1RAB9ASMN1; SMN2 | |
| SCHEMBL28351724 | 0.74 | F2 (0.41) | MAPTHPGD | |
| SCHEMBL28506358 | 0.73 | MAPT (0.43) | MAPTNPC1HPGDRAB9ASMN1; SMN2 | |
| SCHEMBL20572299 | 0.71 | AKR1C3 (0.53) | MAPTNPC1HPGDRAB9ASMN1; SMN2 | |
| SCHEMBL16500277 | 0.71 | AKR1C3 (0.53) | MAPTNPC1HPGDRAB9ASMN1; SMN2 | |
| SCHEMBL17079841 | 0.71 | MAPT (0.50) | MAPTNPC1RAB9ASMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115576170-A | Photosensitive polyimide resin composition | 株式会社 PI 技术研究所 | 2023-01-06 | — | — | CN | disclosed |
| CN-113994257-A | Photosensitive polyimide resin composition | 合肥汉之和新材料科技有限公司 | 2022-01-28 | — | — | CN | disclosed |