SCHEMBL2894490

SCHEMBL2894490

CCC(C)(c1ccc(Oc2ccc(N)cc2)c(C)c1)c1ccc(Oc2ccc(N)cc2)c(C)c1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 5/20 0.55
RAB9A P51151 4/20 0.55
NPC1 O15118 2/20 0.55
ALDH1A1 P00352 6/20 0.49
HPGD P15428 1/20 0.49
MAPK1 P28482 1/20 0.49
L3MBTL1 Q9Y468 2/20 0.43
LMNA P02545 1/20 0.43
ATM Q13315 1/20 0.43
SMN1; SMN2 Q16637 2/20 0.42
TEAD4 Q15561 1/20 0.41
TDP1 Q9NUW8 3/20 0.40
POLB P06746 2/20 0.40
FFAR1 O14842 1/20 0.39
TSHR P16473 2/20 0.38
CYP3A4 P08684 1/20 0.38
VDR P11473 3/20 0.38
KDM4E B2RXH2 1/20 0.37
MEN1 O00255 1/20 0.36
MITF O75030 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL8004085 0.93 MAPT (0.49) MAPTRAB9ANPC1ALDH1A1HPGD
SCHEMBL28551523 0.89 MAPT (0.51) MAPTRAB9ANPC1ALDH1A1HPGD
SCHEMBL1856220 0.84 ALDH1A1 (0.55) MAPTRAB9ANPC1ALDH1A1HPGD
SCHEMBL29393830 0.84 ALDH1A1 (0.55) MAPTRAB9ANPC1ALDH1A1HPGD
SCHEMBL29535518 0.84 ALDH1A1 (0.55) MAPTRAB9ANPC1ALDH1A1HPGD
SCHEMBL30127630 0.82 MAPT (0.47) MAPTRAB9ANPC1ALDH1A1HPGD
SCHEMBL1857763 0.82 MAPT (0.73) MAPTRAB9ANPC1ALDH1A1HPGD
SCHEMBL30055205 0.82 MAPT (0.52) MAPTRAB9ANPC1ALDH1A1HPGD
SCHEMBL29363720 0.81 ALDH1A1 (0.56) MAPTRAB9ANPC1ALDH1A1HPGD
SCHEMBL1857666 0.81 ALDH1A1 (0.56) MAPTRAB9ANPC1ALDH1A1HPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 46 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2662378-B1 IMIDE COMPOUND, METHOD FOR PRODUCING SAME, THICKENING AGENT FOR GREASE, AND GREASE COMPOSITION JX NIPPON OIL & ENERGY CORP (JP) 2018-10-10 EP disclosed
US-9487726-B2 Imide compound, method for producing same, thickening agent for grease, and grease composition JX NIPPON OIL & ENERGY CORPORATION (JP) 2016-11-08 US disclosed
US-8765867-B2 Heat-resistant resin paste and method for producing same HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-07-01 US disclosed
US-8759440-B2 Heat-resistant resin paste HITACHI CHEMICAL COMPANY, LTD. (JP) 2014-06-24 US disclosed
US-20130345102-A1 IMIDE COMPOUND, METHOD FOR PRODUCING SAME, THICKENING AGENT FOR GREASE, AND GREASE COMPOSITION JX NIPPON OIL & ENERGY CORPORATION (JP) 2013-12-26 US disclosed
EP-2662378-A1 IMIDE COMPOUND, METHOD FOR PRODUCING SAME, THICKENING AGENT FOR GREASE, AND GREASE COMPOSITION JX Nippon Oil & Energy Corporation (JP) 2013-11-13 EP disclosed
US-20100285292-A1 Aromatic Polyimide Film and Process for the Production Thereof TEIJIN LIMITED (JP) 2010-11-11 US disclosed
US-20090264582-A1 HEAT-RESISTANT RESIN PASTE HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-10-22 US disclosed
US-7560307-B2 Resin composition, heat-resistant resin paste and semiconductor device using these and method of preparing the same HITACHI CHEMICAL COMPANY, LTD. (JP) 2009-07-14 US disclosed
EP-2055747-A1 HEAT-RESISTANT RESIN PASTE Hitachi Chemical Co., Ltd. (JP) 2009-05-06 EP disclosed
EP-0700532-A1 ALIGNMENT LAYER FOR LIQUID CRYSTALS HOECHST AKTIENGESELLSCHAFT (DE) 1996-03-13 EP disclosed
EP-0690334-A2 Liquid crystal display device HOECHST AKTIENGESELLSCHAFT (DE) 1996-01-03 EP disclosed
US-5437813-A A thin alignment layer comprising an aromatic polyamide-polysiloxane block homo- or copolymer with different content of polysiloxane to adjust optical pretilt angle HOECHST AKTIENGESELLSCHAFT (DE) 1995-08-01 US disclosed
WO-1994028458-A1 ALIGNMENT LAYER FOR LIQUID CRYSTALS HOECHST AKTIENGESELLSCHAFT (DE) 1994-12-08 WO disclosed
EP-0604885-A1 Liquid crystal display device HOECHST AKTIENGESELLSCHAFT (DE) 1994-07-06 EP disclosed
EP-0553612-A2 Polyimides, thermosetting resin compositions containing the polyimides, formed articles of the resin compositions, and production process of the polyimides HITACHI CHEMICAL CO., LTD. (JP) 1993-08-04 EP disclosed
US-5212279-A Hot-melt adhesive and its use in polyimide film and printed circuit board HITACHI CHEMICAL CO., LTD. (JP) 1993-05-18 US disclosed
US-5037862-A Excellent mechanical stability in printing HITACHI CHEMICAL COMPANY, LTD. (JP) 1991-08-06 US disclosed
US-4791157-A REACTING TRIMELLITIC ACID WITH AROMATIC DIAMINE WITH ETHER GROUPS HITACHI CHEMICAL CO. (JP) 1988-12-13 US disclosed
US-4758875-A Resin encapsulated semiconductor device HITACHI, LTD. (JP) 1988-07-19 US disclosed