SCHEMBL29001020

SCHEMBL29001020

Cc1cc(C2CCCCC2)c(C2CCCCC2)c(N)c1N

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
PSMB5 P28074 2/20 0.37
TDO2 P48775 2/20 0.37
ALDH1A1 P00352 1/20 0.32
TP53 P04637 1/20 0.32
CYP3A4 P08684 1/20 0.32
TSHR P16473 1/20 0.32
TDP1 Q9NUW8 1/20 0.32
JAK2 O60674 1/20 0.32
JAK1 P23458 1/20 0.32
TYK2 P29597 1/20 0.32
JAK3 P52333 1/20 0.32
NUDT1 P36639 1/20 0.32
BACE1 P56817 1/20 0.32
KDM4E B2RXH2 1/20 0.32
MEN1 O00255 1/20 0.32
MAPT P10636 1/20 0.32
KMT2A Q03164 1/20 0.32
CHEK1 O14757 2/20 0.32
PTGS2 P35354 1/20 0.31
CNR1 P21554 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3422636 0.80 TDO2 (0.36) PSMB5TDO2JAK2JAK1TYK2
SCHEMBL2940858 0.79 PSMB5 (0.38) PSMB5TDO2ALDH1A1TP53CYP3A4
SCHEMBL28328037 0.76 PSMB5 (0.49) PSMB5TDO2ALDH1A1TP53CYP3A4
SCHEMBL532225 0.76 ALDH1A1 (0.33) PSMB5TDO2ALDH1A1TP53CYP3A4
SCHEMBL9167795 0.75 PSMB5 (0.46) PSMB5TDO2JAK2JAK1TYK2
SCHEMBL3400335 0.74 TDO2 (0.37) PSMB5TDO2JAK2JAK1TYK2
Hydrochloric Acid SCHEMBL28329189 0.74 PSMB5 (0.47) PSMB5TDO2ALDH1A1TP53CYP3A4
Hydrochloric Acid SCHEMBL28510609 0.74 PSMB5 (0.47) PSMB5TDO2ALDH1A1TP53CYP3A4
SCHEMBL532888 0.73 CYP3A4 (0.34) ALDH1A1TP53CYP3A4TSHRTDP1
SCHEMBL24521805 0.72 TDP1 (0.42) PSMB5TDO2ALDH1A1TP53CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115612438-B Heat-conducting polyurethane structural adhesive with improved high-temperature retention rate and preparation method thereof 山东一诺威聚氨酯股份有限公司 2023-05-09 CN disclosed