Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 3/20 | 0.51 |
| ▸ | HTT | P42858 | 2/20 | 0.51 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.51 |
| ▸ | RAB9A | P51151 | 2/20 | 0.50 |
| ▸ | HPGD | P15428 | 2/20 | 0.50 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.49 |
| ▸ | KDM4E | B2RXH2 | 1/20 | 0.49 |
| ▸ | NPC1 | O15118 | 1/20 | 0.49 |
| ▸ | ALDH1A1 | P00352 | 3/20 | 0.48 |
| ▸ | GAA | P10253 | 2/20 | 0.48 |
| ▸ | UBE2T | Q9NPD8 | 1/20 | 0.46 |
| ▸ | ASIC3 | Q9UHC3 | 1/20 | 0.46 |
| ▸ | MEN1 | O00255 | 2/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.46 |
| ▸ | MAPT | P10636 | 2/20 | 0.46 |
| ▸ | PKM | P14618 | 1/20 | 0.46 |
| ▸ | POLB | P06746 | 1/20 | 0.46 |
| ▸ | L3MBTL1 | Q9Y468 | 2/20 | 0.45 |
| ▸ | SLC13A5 | Q86YT5 | 1/20 | 0.45 |
| ▸ | LMNA | P02545 | 1/20 | 0.45 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL1730426 | 0.85 | KDM4E (0.51) | SMN1; SMN2HTTALOX15RAB9AHPGD | |
| SCHEMBL1412772 | 0.83 | KDM4E (0.52) | SMN1; SMN2HTTALOX15RAB9AHPGD | |
| SCHEMBL29113946 | 0.81 | UBE2T (0.56) | SMN1; SMN2HTTALOX15RAB9AHPGD | |
| SCHEMBL8412718 | 0.78 | UBE2T (0.53) | SMN1; SMN2HTTALOX15RAB9AHPGD | |
| SCHEMBL1412767 | 0.77 | SMN1; SMN2 (0.64) | SMN1; SMN2HTTALOX15RAB9AHPGD | |
| Water SCHEMBL29837412 | 0.76 | MAPT (0.48) | SMN1; SMN2HTTALOX15RAB9AHPGD | |
| SCHEMBL292002 | 0.76 | SMN1; SMN2 (0.50) | SMN1; SMN2HTTALOX15RAB9AHPGD | |
| SCHEMBL28795915 | 0.76 | SMN1; SMN2 (0.69) | SMN1; SMN2HTTALOX15RAB9AHPGD | |
| SCHEMBL5707861 | 0.75 | SMN1; SMN2 (0.43) | SMN1; SMN2HTTALOX15RAB9AHPGD | |
| SCHEMBL19372016 | 0.75 | UBE2T (0.70) | SMN1; SMN2HTTALOX15RAB9AHPGD |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-9243339-B2 | Additives for producing copper electrodeposits having low oxygen content | CITIBANK, N.A. | 2016-01-26 | — | — | US | claimed |
| EP-2855738-A1 | ADDITIVES FOR PRODUCING COPPER ELECTRODEPOSITS HAVING LOW OXYGEN CONTENT | MacDermid Acumen, Inc. (US) | 2015-04-08 | — | — | EP | claimed |
| US-20130313119-A1 | Additives for Producing Copper Electrodeposits Having Low Oxygen Content | CITIBANK, N.A. | 2013-11-28 | — | — | US | claimed |
| WO-2013176796-A1 | ADDITIVES FOR PRODUCING COPPER ELECTRODEPOSITS HAVING LOW OXYGEN CONTENT | MACDERMID ACUMEN,INC. (US) | 2013-11-28 | — | — | WO | claimed |
| EP-2483454-A2 | COPPER ELECTROPLATING COMPOSITION | BASF SE (DE) | 2012-08-08 | — | — | EP | claimed |
| US-20120175744-A1 | COPPER ELECTROPLATING COMPOSITION | BASF SE (DE) | 2012-07-12 | — | — | US | claimed |
| US-20240194495-A1 | METHOD OF MANUFACTURING CONDUCTIVE STRUCTURE, METHOD OF MANUFACTURING REDISTRIBUTION CIRCUIT STRUCTURE AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. (TW) | 2024-06-13 | — | — | US | disclosed |
| EP-2963158-B1 | PLATING METHOD | ROHM & HAAS ELECT MAT (US) | 2021-05-26 | — | — | EP | disclosed |
| US-10988852-B2 | Method of electroplating copper into a via on a substrate from an acid copper electroplating bath | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2021-04-27 | — | — | US | disclosed |
| EP-1644558-B1 | HIGH PURITY ELECTROLYTIC SULFONIC ACID SOLUTIONS | ARKEMA INC (US) | 2019-04-03 | — | — | EP | disclosed |
| EP-3162921-B1 | METHOD OF ELECTROPLATING COPPER INTO A VIA ON A SUBSTRATE FROM AN ACID COPPER ELECTROPLATING BATH | ROHM & HAAS ELECT MAT (US) | 2018-11-28 | — | — | EP | disclosed |
| EP-3040451-B1 | REACTION PRODUCTS OF AMINO ACIDS AND EPOXIES | ROHM & HAAS ELECT MAT (US) | 2018-07-25 | — | — | EP | disclosed |
| US-9809891-B2 | Plating method | ROHM AND HAAS ELECTRONIC MATERIALS LLC (US) | 2017-11-07 | — | — | US | disclosed |
| EP-1197587-A2 | Seed layer repair and electroplating bath | Shipley Co. L.L.C. (US) | 2002-04-17 | — | — | EP | disclosed |
| US-20010047943-A1 | ELECTROLYTIC COPPER PLATING SOLUTIONS | SHIPLEY COMPANY, L.L.C. | 2001-12-06 | — | — | US | disclosed |
| EP-1069211-A2 | Electroplating solutions | THE BOC GROUP, INC. (US) | 2001-01-17 | — | — | EP | disclosed |
| EP-1054080-A2 | Electrolytic copper plating solutions | Shipley Company LLC (US) | 2000-11-22 | — | — | EP | disclosed |
| US-5252196-A | Containing specified concentrations of brighteners and leveling agents; irregular topography | SHIPLEY COMPANY INC. (US) | 1993-10-12 | — | — | US | disclosed |
| US-5051154-A | Copper salt, an electrolyte and an organic additive for modification of the charge transfer overpotential | SHIPLEY COMPANY INC. (US) | 1991-09-24 | — | — | US | disclosed |
| EP-0440027-A2 | Additive for acid-copper electroplating baths to increase throwing power | SHIPLEY COMPANY INC. (US) | 1991-08-07 | — | — | EP | disclosed |