Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | SMN1; SMN2 | Q16637 | 5/20 | 0.50 |
| ▸ | RAB9A | P51151 | 3/20 | 0.50 |
| ▸ | NPC1 | O15118 | 2/20 | 0.50 |
| ▸ | APEX1 | P27695 | 1/20 | 0.50 |
| ▸ | UBE2T | Q9NPD8 | 1/20 | 0.47 |
| ▸ | ASIC3 | Q9UHC3 | 1/20 | 0.47 |
| ▸ | HTT | P42858 | 2/20 | 0.46 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.46 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.46 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.46 |
| ▸ | HPGD | P15428 | 3/20 | 0.45 |
| ▸ | KMT2A | Q03164 | 3/20 | 0.45 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.45 |
| ▸ | MEN1 | O00255 | 2/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 2/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.44 |
| ▸ | MAPT | P10636 | 2/20 | 0.43 |
| ▸ | GAA | P10253 | 2/20 | 0.43 |
| ▸ | PSMB8 | P28062 | 1/20 | 0.43 |
| ▸ | PSMB5 | P28074 | 1/20 | 0.43 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL30950697 | 0.86 | SMN1; SMN2 (0.48) | SMN1; SMN2RAB9ANPC1APEX1UBE2T | |
| SCHEMBL1446355 | 0.86 | SMN1; SMN2 (0.48) | SMN1; SMN2RAB9ANPC1APEX1UBE2T | |
| SCHEMBL29096740 | 0.83 | SMN1; SMN2 (0.50) | SMN1; SMN2RAB9ANPC1APEX1UBE2T | |
| SCHEMBL30950696 | 0.79 | UBE2T (0.53) | SMN1; SMN2RAB9ANPC1UBE2TASIC3 | |
| SCHEMBL28795915 | 0.77 | SMN1; SMN2 (0.69) | SMN1; SMN2RAB9ANPC1UBE2TASIC3 | |
| SCHEMBL2904753 | 0.76 | SMN1; SMN2 (0.51) | SMN1; SMN2RAB9ANPC1UBE2TASIC3 | |
| SCHEMBL8414136 | 0.75 | UBE2T (0.56) | SMN1; SMN2RAB9ANPC1UBE2TASIC3 | |
| SCHEMBL28114059 | 0.75 | CYP1A2 (0.50) | SMN1; SMN2RAB9ANPC1UBE2TASIC3 | |
| SCHEMBL2134712 | 0.73 | UBE2T (0.50) | SMN1; SMN2RAB9ANPC1UBE2TASIC3 | |
| SCHEMBL29023737 | 0.73 | UBE2T (0.53) | SMN1; SMN2RAB9ANPC1UBE2TASIC3 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 272 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-115198309-A | Electrolysis method for purifying low-silver low-sulfur ultra-high-purity copper | 江苏鑫瑞崚新材料科技有限公司 | 2022-10-18 | — | — | CN | claimed |
| CN-109863261-B | Defect-free filling method of through silicon via and copper plating solution used for filling method | 韩国生产技术研究院 | 2021-08-20 | — | — | CN | claimed |
| US-10982343-B2 | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-04-20 | — | — | US | claimed |
| US-20200347504-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-11-05 | — | — | US | claimed |
| EP-3483307-B1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-04-01 | — | — | EP | claimed |
| EP-3312920-B1 | ELECTROLYTIC COPPER FOIL FOR LITHIUM SECONDARY BATTERY AND LITHIUM SECONDARY BATTERY INCLUDING SAME | KCF TECH CO LTD (KR) | 2020-03-18 | — | — | EP | claimed |
| CN-108026656-B | Electro-coppering organic additive comprising two kinds of leveling agents and include the electrolytic copper plating solution of the additive | 韩国生产技术研究院 | 2019-10-01 | — | — | CN | claimed |
| CN-109863261-A | The zero defect fill method of silicon through electrode and copper plating bath for the fill method | 韩国生产技术研究院 | 2019-06-07 | — | — | CN | claimed |
| EP-3483307-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH Deutschland GmbH (DE) | 2019-05-15 | — | — | EP | claimed |
| CN-108350590-A | It is used to form the electro-coppering organic additive of high-flatness copper plating film and the electrolytic copper plating solution comprising the additive | 韩国生产技术研究院 | 2018-07-31 | — | — | CN | claimed |
| US-20090101515-A1 | IRON-PHOSPHORUS ELECTROPLATING BATH AND METHOD | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2009-04-23 | — | — | US | claimed |
| US-20080142370-A1 | Aqueous, Acidic Solution and Method for Electrolytically Depositing Copper Coatings as Well as Use of Said Solution | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-06-19 | — | — | US | claimed |
| EP-1651801-B1 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-01-23 | — | — | EP | claimed |
| US-20070215490-A1 | METHOD OF ANALYZING ACCELERATOR FOR COPPER ELECTROPLATING | ROCKWOOD ELECTROCHEMICALS ASIA LTD. (TW) | 2007-09-20 | — | — | US | claimed |
| EP-1152071-B1 | Copper plating method | ELECTROPLATING ENG (JP) | 2005-09-07 | — | — | EP | claimed |
| EP-1152071-A1 | Copper plating method | Electroplating Engineers of Japan Limited (JP) | 2001-11-07 | — | — | EP | claimed |
| EP-0785297-B1 | An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application | ATOTECH DEUTSCHLAND GMBH (DE) | 2000-01-05 | — | — | EP | claimed |
| EP-0785297-A2 | An aqueous acid bath for the electrodeposition of a shiny and tear-free copper coating and its application | ATOTECH Deutschland GmbH (DE) | 1997-07-23 | — | — | EP | claimed |
| EP-0598763-B1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1995-12-13 | — | — | EP | claimed |
| WO-1993003204-A1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1993-02-18 | — | — | WO | claimed |