SCHEMBL2906334

SCHEMBL2906334

Oc1ccc2cc(Oc3ccc(Oc4ccc5cc(O)ccc5c4)nc3)ccc2c1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
THRB P10828 1/20 0.46
HAO1 Q9UJM8 1/20 0.41
FTO Q9C0B1 1/20 0.41
CYP1A2 P05177 1/20 0.39
MEN1 O00255 3/20 0.39
KMT2A Q03164 3/20 0.39
ESR1 P03372 2/20 0.39
ESR2 Q92731 2/20 0.39
EGLN1 Q9GZT9 1/20 0.39
SCN9A Q15858 5/20 0.38
KDM4E B2RXH2 4/20 0.38
POLB P06746 1/20 0.38
HSD17B1 P14061 1/20 0.38
HSD17B10 Q99714 2/20 0.37
CYP3A4 P08684 1/20 0.37
ALOX15 P16050 1/20 0.37
TSHR P16473 1/20 0.37
HIF1A Q16665 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
SCN10A Q9Y5Y9 3/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2898810 0.83 MEN1 (0.58) MEN1KMT2AESR1ESR2KDM4E
SCHEMBL2906030 0.82 MEN1 (0.45) HAO1FTOCYP1A2MEN1KMT2A
SCHEMBL10014247 0.81 ESR1 (0.57) CYP1A2MEN1KMT2AESR1ESR2
SCHEMBL2905418 0.79 CYP1A2 (0.39) HAO1FTOCYP1A2MEN1KMT2A
SCHEMBL23386082 0.79 ESR1 (0.62) CYP1A2MEN1KMT2AESR1ESR2
SCHEMBL2906411 0.79 CYP1A2 (0.42) HAO1FTOCYP1A2MEN1KMT2A
SCHEMBL2904535 0.79 MEN1 (0.52) MEN1KMT2AESR1ESR2KDM4E
SCHEMBL2903830 0.79 HSD17B1 (0.47) HAO1FTOCYP1A2MEN1KMT2A
SCHEMBL5686998 0.78 SCN7A (0.47) HAO1CYP1A2MEN1KMT2AESR1
SCHEMBL20356051 0.77 CYP1A2 (0.58) CYP1A2MEN1KMT2AESR1ESR2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1636209-B1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL CO (JP) 2010-08-11 EP disclosed
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed