SCHEMBL2904535

SCHEMBL2904535

Oc1ccc(-c2ccc(Oc3ccc(Oc4ccc(-c5ccc(O)cc5)cc4)nc3)cc2)cc1

nearest known ligand 0.52

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.52
KMT2A Q03164 3/20 0.52
ESR2 Q92731 3/20 0.52
ESR1 P03372 2/20 0.52
LTA4H P09960 6/20 0.45
NR1H2 P55055 1/20 0.45
BAX Q07812 1/20 0.45
GPR84 Q9NQS5 2/20 0.43
NPC1 O15118 1/20 0.42
RAB9A P51151 1/20 0.42
KDM4E B2RXH2 1/20 0.42
ACACB O00763 1/20 0.40
ACACA Q13085 1/20 0.40
MAPK1 P28482 1/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2898810 0.94 MEN1 (0.58) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL2901613 0.80 ESR2 (0.54) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL9581090 0.79 ESR2 (0.82) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL371587 0.79 ESR2 (0.82) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL10611804 0.79 ESR2 (0.82) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL14148732 0.79 ESR2 (0.82) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL2196668 0.79 ESR2 (0.82) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL8663280 0.79 ESR2 (0.82) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL21495883 0.79 ESR2 (0.82) MEN1KMT2AESR2ESR1LTA4H
SCHEMBL2906334 0.79 THRB (0.46) MEN1KMT2AESR2ESR1KDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1636209-B1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL CO (JP) 2010-08-11 EP disclosed
US-7279574-B2 Epoxy compound and cured epoxy resin product SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2007-10-09 US disclosed
US-20060159929-A1 Epoxy compound and cured epoxy resin product HITACHI, LTD. (JP) 2006-07-20 US disclosed
EP-1636209-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT Sumitomo Chemical Company, Limited (JP) 2006-03-22 EP disclosed
WO-2004113327-A1 EPOXY COMPOUND AND CURED EPOXY RESIN PRODUCT SUMITOMO CHEMICAL COMPANY, LIMITED (JP) 2004-12-29 WO disclosed