Predicted protein targets (top 9)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 8/20 | 0.38 |
| ▸ | LMNA | P02545 | 1/20 | 0.38 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.38 |
| ▸ | TSHR | P16473 | 2/20 | 0.32 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.32 |
| ▸ | MGAM | O43451 | 1/20 | 0.31 |
| ▸ | GAA | P10253 | 1/20 | 0.31 |
| ▸ | SI | P14410 | 1/20 | 0.31 |
| ▸ | MGAM2 | Q2M2H8 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Alcohol SCHEMBL7007847 | 0.89 | — | — | |
| Ethylene Glycol SCHEMBL4817329 | 0.89 | ALDH1A1 (0.42) | ALDH1A1LMNAHSD17B10TSHRMGAM | |
| Butyl Alcohol SCHEMBL11341268 | 0.88 | ALDH1A1 (0.50) | ALDH1A1LMNAHSD17B10TSHR | |
| SCHEMBL305079 | 0.83 | — | — | |
| Acetic Acid Methyl Ester SCHEMBL467959 | 0.80 | — | — | |
| Di(Hydroxyethyl)Ether SCHEMBL3698560 | 0.80 | TSHR (0.48) | ALDH1A1TSHR | |
| SCHEMBL9585374 | 0.80 | — | — | |
| SCHEMBL4479247 | 0.80 | — | — | |
| SCHEMBL5055634 | 0.80 | — | — | |
| SCHEMBL5860426 | 0.80 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 297 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110722623-B | Cutting protection structure | 拓旷(上海)光电科技有限公司 | 2021-07-27 | — | — | CN | claimed |
| CN-104272193-B | Diluent composition | 株式会社东进世美肯 | 2019-08-23 | — | — | CN | claimed |
| US-8975318-B2 | Halogen-free benzoxazine based curable compositions for high TG applications | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) | 2015-03-10 | — | — | US | claimed |
| EP-2819642-A1 | PATTERNED NAIL VARNISH COMPOSITION | Fiabila (FR) | 2015-01-07 | — | — | EP | claimed |
| CN-104272193-A | diluent composition | DONGJIN SEMICHEM CO LTD | 2015-01-07 | — | — | CN | claimed |
| US-8912259-B2 | Formulated benzoxazine based system for transportation applications | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) | 2014-12-16 | — | — | US | claimed |
| EP-2609136-B1 | FORMULATED BENZOXAZINE BASED SYSTEM FOR TRANSPORTATION APPLICATIONS | HUNTSMAN ADV MAT AMERICAS INC (US) | 2014-11-26 | — | — | EP | claimed |
| WO-2013128126-A1 | PATTERNED NAIL VARNISH COMPOSITION | FIABILA (FR) | 2013-09-06 | — | — | WO | claimed |
| EP-2609136-A1 | FORMULATED BENZOXAZINE BASED SYSTEM FOR TRANSPORTATION APPLICATIONS | Huntsman Advanced Materials Americas LLC (US) | 2013-07-03 | — | — | EP | claimed |
| US-20130143457-A1 | Formulated Benzoxazine Based System for Transportation Applications | HUNTSMAN ADVANCED MATERIALS AMERICAS LLC (US) | 2013-06-06 | — | — | US | claimed |
| EP-1697985-A1 | COMBINATIONS OF RESIN COMPOSITIONS AND METHODS OF USE THEREOF | GENERAL ELECTRIC COMPANY (US) | 2006-09-06 | — | — | EP | claimed |
| US-20060147719-A1 | Curable epoxy composition with colloidal silica and phenolic resins on substrates | MOMENTIVE PERFORMANCE MATERIALS INC. | 2006-07-06 | — | — | US | claimed |
| EP-1665375-A1 | SOLVENT-MODIFIED RESIN COMPOSITIONS AND METHODS OF USE THEREOF | General Electric Company, (a New York Corporation) (US) | 2006-06-07 | — | — | EP | claimed |
| EP-1665376-A1 | SOLVENT-MODIFIED RESIN SYSTEM CONTAINING FILLER THAT HAS HIGH Tg, TRANSPARENCY AND GOOD RELIABILITY IN WAFER LEVEL UNDERFILL APPLICATIONS | GENERAL ELECTRIC COMPANY (US) | 2006-06-07 | — | — | EP | claimed |
| WO-2005062369-A1 | COMBINATIONS OF RESIN COMPOSITIONS AND METHODS OF USE THEREOF | GENERAL ELECTRIC COMPANY (US) | 2005-07-07 | — | — | WO | claimed |
| US-20050131106-A1 | Combinations of resin compositions and methods of use thereof | MOMENTIVE PERFORMANCE MATERIALS INC. | 2005-06-16 | — | — | US | claimed |
| WO-2005024938-A1 | SOLVENT-MODIFIED RESIN COMPOSITIONS AND METHODS OF USE THEREOF | GENERAL ELECTRIC COMPANY (US) | 2005-03-17 | — | — | WO | claimed |
| WO-2005024939-A1 | SOLVENT-MODIFIED RESIN SYSTEM CONTAINING FILLER THAT HAS HIGH Tg, TRANSPARENCY AND GOOD RELIABILITY IN WAFER LEVEL UNDERFILL APPLICATIONS | GENERAL ELECTRIC COMPANY (US) | 2005-03-17 | — | — | WO | claimed |
| US-20050049352-A1 | Solvent-modified resin compositions and methods of use thereof | GENERAL ELECTRIC COMPANY | 2005-03-03 | — | — | US | claimed |
| US-20050049334-A1 | Solvent-modified resin system containing filler that has high Tg, transparency and good reliability in wafer level underfill applications | GENERAL ELECTRIC COMPANY | 2005-03-03 | — | — | US | claimed |