SCHEMBL29089262

SCHEMBL29089262

Cc1cc(C)c(C(=O)[P](C)=O)c(C)c1

nearest known ligand 0.38

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TAS1R3 Q7RTX0 4/20 0.38
TAS1R1 Q7RTX1 4/20 0.38
TAS1R2 Q8TE23 4/20 0.38
KMT2A Q03164 3/20 0.37
HPGD P15428 2/20 0.37
KDM4E B2RXH2 2/20 0.37
L3MBTL1 Q9Y468 1/20 0.37
MEN1 O00255 1/20 0.37
LMNA P02545 1/20 0.37
SMN1; SMN2 Q16637 1/20 0.37
NPSR1 Q6W5P4 1/20 0.37
MCOLN3 Q8TDD5 1/20 0.37
ALDH1A1 P00352 4/20 0.36
MAPT P10636 2/20 0.35
MAPK1 P28482 1/20 0.35
TPMT P51580 1/20 0.34
CA1 P00915 1/20 0.33
CA2 P00918 1/20 0.33
MMP1 P03956 1/20 0.33
MMP2 P08253 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1031821 0.84 ALDH1A1 (0.40) TAS1R3TAS1R1TAS1R2KMT2AHPGD
SCHEMBL28338083 0.84 TAS1R3 (0.40) TAS1R3TAS1R1TAS1R2KMT2AHPGD
SCHEMBL28048319 0.84 TAS1R3 (0.39) TAS1R3TAS1R1TAS1R2KMT2AHPGD
SCHEMBL460622 0.84 KMT2A (0.40) TAS1R3TAS1R1TAS1R2KMT2AHPGD
SCHEMBL24762253 0.82 TAS1R3 (0.42) TAS1R3TAS1R1TAS1R2KMT2AHPGD
Ethane SCHEMBL8533302 0.82 KMT2A (0.39) TAS1R3TAS1R1TAS1R2KMT2AHPGD
SCHEMBL22157680 0.82 KMT2A (0.39) TAS1R3TAS1R1TAS1R2KMT2AHPGD
SCHEMBL22157785 0.82 KMT2A (0.39) TAS1R3TAS1R1TAS1R2KMT2AHPGD
Benzene SCHEMBL16236190 0.80 KDM4E (0.40) TAS1R3TAS1R1TAS1R2KMT2AHPGD
SCHEMBL19221712 0.79 TAS1R3 (0.39) TAS1R3TAS1R1TAS1R2KMT2AHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-110447097-B Warp correction material and manufacturing method of fan-out type wafer level package 太阳控股株式会社 2023-09-01 CN disclosed