SCHEMBL29118554

SCHEMBL29118554

COCC(C)(OC(N)=O)c1ccccc1

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAPT P10636 1/20 0.46
KMT2A Q03164 1/20 0.46
CYP2C19 P33261 1/20 0.44
HIF1A Q16665 1/20 0.44
KCNN4 O15554 2/20 0.41
CYP1A2 P05177 2/20 0.39
CYP2D6 P10635 1/20 0.39
CES1 P23141 1/20 0.38
KIF11 P52732 3/20 0.36
ALDH1A1 P00352 2/20 0.36
ALOX15 P16050 2/20 0.36
TAAR1 Q96RJ0 1/20 0.36
HDAC3 O15379 1/20 0.36
HDAC4 P56524 1/20 0.36
HDAC1 Q13547 1/20 0.36
HDAC7 Q8WUI4 1/20 0.36
HDAC2 Q92769 1/20 0.36
HDAC10 Q969S8 1/20 0.36
HDAC11 Q96DB2 1/20 0.36
HDAC8 Q9BY41 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16382772 0.85 CYP2C19 (0.46) MAPTKMT2ACYP2C19HIF1AKCNN4
SCHEMBL16732400 0.83 KCNN4 (0.44) MAPTKMT2ACYP2C19HIF1AKCNN4
SCHEMBL27596019 0.83 MAPT (0.48) MAPTKMT2ACYP2C19HIF1AKCNN4
SCHEMBL29118559 0.83 KMT2A (0.48) MAPTKMT2ACYP2C19HIF1AKCNN4
SCHEMBL2283147 0.83 MAPT (0.48) MAPTKMT2ACYP2C19HIF1AKCNN4
SCHEMBL29154737 0.82 SCN5A (0.43) MAPTKMT2AKIF11SMN1; SMN2
SCHEMBL28559912 0.82 TDP1 (0.44) CYP1A2ALDH1A1LMNACYP3A4RECQL
SCHEMBL10518614 0.81 MAPT (0.47) MAPTKMT2ACYP2C19HIF1AKCNN4
SCHEMBL16028069 0.81 MAPT (0.47) MAPTKMT2ACYP2C19HIF1AKCNN4
SCHEMBL7619909 0.80 SLC6A2 (0.48) MAPTKMT2ACYP2C19HIF1ACYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115718406-A Photosensitive resin composition for forming resist, resin film, cured film, and semiconductor device 住友电木株式会社 2023-02-28 CN disclosed