SCHEMBL29120630

SCHEMBL29120630

O=C(Cl)C1(c2ccccc2)C=CC=CC1

nearest known ligand 0.39

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
HDAC4 P56524 5/20 0.39
HSD11B1 P28845 4/20 0.35
AKR1C1 Q04828 1/20 0.34
HDAC9 Q9UKV0 1/20 0.33
MEN1 O00255 1/20 0.32
KMT2A Q03164 1/20 0.32
CYP11B1 P15538 1/20 0.30
OPRM1 P35372 1/20 0.30
OPRL1 P41146 1/20 0.30
LMNA P02545 1/20 0.30
HTT P42858 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4451679 0.86 HDAC4 (0.41) HDAC4HSD11B1AKR1C1HDAC9KMT2A
Benzene SCHEMBL28354853 0.86 HDAC4 (0.41) HDAC4HSD11B1AKR1C1HDAC9KMT2A
SCHEMBL15529967 0.83 HDAC4 (0.39) HDAC4HSD11B1AKR1C1HDAC9OPRM1
SCHEMBL3836530 0.83 HDAC4 (0.39) HDAC4HSD11B1AKR1C1HDAC9MEN1
SCHEMBL29531155 0.81 HDAC4 (0.38) HDAC4AKR1C1HDAC9LMNA
SCHEMBL28916077 0.79 HDAC4 (0.33) HDAC4
SCHEMBL28878362 0.79 HDAC4 (0.33) HDAC4
SCHEMBL14889498 0.76 CES2 (0.36) HDAC4HSD11B1OPRM1OPRL1LMNA
Acetonitrile SCHEMBL28747283 0.76 CYP11B1 (0.34) HDAC4AKR1C1MEN1KMT2ACYP11B1
SCHEMBL28525089 0.76 SMN1; SMN2 (0.39) HDAC4MEN1KMT2ALMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112409759-B Preparation method and application of resin-based low-dielectric composite material 江苏高驰新材料科技有限公司 2023-10-17 CN claimed
CN-112409759-A Preparation method and application of resin-based low-dielectric composite material 裴佩 2021-02-26 CN claimed
CN-112409759-B Preparation method and application of resin-based low-dielectric composite material 江苏高驰新材料科技有限公司 2023-10-17 CN disclosed
CN-112409759-A Preparation method and application of resin-based low-dielectric composite material 裴佩 2021-02-26 CN disclosed