SCHEMBL29131799

SCHEMBL29131799

Cc1ccc(C(=O)c2ccc(O)c(O)c2O)c(C(=O)c2ccccc2)c1

nearest known ligand 0.71

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
HDAC1 Q13547 1/20 0.53
MAPT P10636 4/20 0.50
KDM4E B2RXH2 3/20 0.50
ALOX15 P16050 3/20 0.50
HSD17B10 Q99714 3/20 0.50
MAPK1 P28482 2/20 0.50
HPGD P15428 4/20 0.49
ALDH1A1 P00352 3/20 0.49
MEN1 O00255 2/20 0.49
KMT2A Q03164 2/20 0.49
RECQL P46063 2/20 0.49
ALOX12 P18054 1/20 0.49
POLB P06746 1/20 0.48
AKR1C3 P42330 1/20 0.47
USP2 O75604 1/20 0.47
GAA P10253 1/20 0.47
KEAP1 Q14145 1/20 0.47
NFE2L2 Q16236 1/20 0.47
CSNK2A1 P68400 1/20 0.47
NPSR1 Q6W5P4 1/20 0.47

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30669864 0.92 HDAC1 (0.57) HDAC1MAPTKDM4EALOX15HSD17B10
SCHEMBL28384878 0.86 AKR1C3 (0.61) MAPTKDM4EMAPK1MEN1KMT2A
SCHEMBL10621924 0.84 CSNK2A1 (0.61) MAPTKDM4EHSD17B10HPGDMEN1
SCHEMBL29366285 0.84 HDAC1 (0.66) HDAC1MAPTKDM4EALOX15HSD17B10
SCHEMBL27811794 0.84 HDAC1 (0.66) HDAC1MAPTKDM4EALOX15HSD17B10
SCHEMBL93423 0.84 HDAC1 (0.66) HDAC1MAPTKDM4EALOX15HSD17B10
SCHEMBL8416108 0.83 HDAC1 (0.48) HDAC1MAPTKDM4EALOX15HSD17B10
SCHEMBL10768257 0.83 HDAC1 (0.61) HDAC1MAPTKDM4EALOX15HSD17B10
SCHEMBL147250 0.82 CSNK2A1 (0.63) MAPTKDM4EHSD17B10HPGDMEN1
SCHEMBL29823118 0.82 CSNK2A1 (0.63) MAPTKDM4EHSD17B10HPGDMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117099045-A Negative photosensitive resin composition, cured product, laminate, method for producing cured product, and semiconductor device 富士胶片株式会社 2023-11-21 CN disclosed