SCHEMBL1446355

SCHEMBL1446355

O=S(=O)([O-])CC(S)Cc1nc2ccccc2s1.[Na+]

nearest known ligand 0.48

Known targets — ChEMBL curated mechanism

ABCC8ACEADORA1ADORA2AADORA2BADORA3ALDH5A1ALOX5ALOX5APATP4AATP4BBRAFCA1CA12CA2CA4CYSLTR1DHFRDPEP1EDNRAEDNRBESR2F10FDPSFGF1GABBR1GABBR2GABRA1GABRA2GABRA3GABRA4GABRA5GABRA6GABRB1GABRB2GABRB3GABRDGABREGABRG1GABRG2GABRG3GABRPGABRQGARTGNRHRGSC1HMGCRIMPDH1IMPDH2KCNJ11LY96NOD2NR3C1NS3NS4ANS5bP2RY1P2RY12P2RY2P2RY4P2RY6PBP2XPDE3APDE3BPDE4APDE4BPDE4CPDE4DPDK1PDK2PDK3PDK4PPARGPPATPTGIRPTGS1PTGS2RAF1RYR1RYR3SCN10ASCN11ASCN1ASCN2ASCN3ASCN4ASCN5ASCN7ASCN8ASCN9ASERPINC1SLC12A1SLC12A3SYKTHRATHRBTLR3TLR4TLR9TUBA1ATUBA1BTUBA1CTUBA3CTUBA3ETUBA4ATUBBTUBB1TUBB2ATUBB2BTUBB3TUBB4ATUBB4BTUBB6TUBB8TYMSVKORC1XDHblablaIMP-1blaOXA-33blaOXA-58blaT-3blaT-4blaT-5blaT-6dacAdacBdacCfolAfolPfolP1ftsIfusAgaggyrAgyrBmecAmrcAmrcBmrdApbp1apbp1bpbp2pbp2apbp2bpbp3pbp4pbpApbpBpbpCpbpFpolponBrplArplBrplCrplDrplErplFrplJrplKrplLrplMrplNrplOrplPrplQrplRrplSrplTrplUrplVrplWrplXrplYrpmArpmBrpmCrpmDrpmErpmFrpmGrpmHrpmIrpmJrpoArpoBrpoCrpoZrpsArpsBrpsCrpsDrpsErpsFrpsGrpsHrpsIrpsJrpsKrpsLrpsMrpsNrpsOrpsPrpsQrpsRrpsSrpsTrpsUykgMykgO

The experimentally established mechanism targets of None. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CA12 known ✓ O43570 1/20 0.40
▸ CA1 known ✓ P00915 1/20 0.40
▸ CA2 known ✓ P00918 1/20 0.40
▸ CA4 known ✓ P22748 1/20 0.40
▸ SMN1; SMN2 Q16637 6/20 0.48
▸ RAB9A P51151 3/20 0.48
▸ NPC1 O15118 2/20 0.48
▸ UBE2T Q9NPD8 1/20 0.45
▸ ASIC3 Q9UHC3 1/20 0.45
▸ KDM4E B2RXH2 2/20 0.45
▸ TDP1 Q9NUW8 1/20 0.45
▸ HTT P42858 2/20 0.44
▸ GAA P10253 2/20 0.44
▸ ALDH1A1 P00352 2/20 0.44
▸ PKM P14618 1/20 0.43
▸ PSMB8 P28062 1/20 0.41
▸ PSMB5 P28074 1/20 0.41
▸ ALOX15 P16050 1/20 0.41
▸ CYP1A2 P05177 1/20 0.41
▸ CYP2C19 P33261 1/20 0.41

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL30950697 1.00 SMN1; SMN2 (0.48) SMN1; SMN2RAB9ANPC1UBE2TASIC3
SCHEMBL292002 0.86 SMN1; SMN2 (0.50) SMN1; SMN2RAB9ANPC1UBE2TASIC3
SCHEMBL30950696 0.77 UBE2T (0.53) SMN1; SMN2RAB9ANPC1UBE2TASIC3
SCHEMBL1730426 0.76 KDM4E (0.51) SMN1; SMN2RAB9ANPC1UBE2TASIC3
SCHEMBL29595720 0.73 KDM4E (0.58) SMN1; SMN2RAB9ANPC1UBE2TASIC3
SCHEMBL8414136 0.73 UBE2T (0.56) SMN1; SMN2RAB9ANPC1UBE2TASIC3
SCHEMBL29096740 0.72 SMN1; SMN2 (0.50) SMN1; SMN2RAB9ANPC1UBE2TASIC3
SCHEMBL2134712 0.71 UBE2T (0.50) SMN1; SMN2RAB9ANPC1UBE2TASIC3
SCHEMBL10448550 0.71 SMN1; SMN2 (0.46) SMN1; SMN2RAB9ANPC1UBE2TASIC3
SCHEMBL29023737 0.71 UBE2T (0.53) SMN1; SMN2RAB9ANPC1UBE2TASIC3

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 93 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-118241268-A High tensile strength electrolytic copper foil additive, electrolytic copper foil and preparation method 陕西未来尖端材料科技有限公司 2024-06-25 — — CN claimed
CN-114277413-B Copper plating solution for circuit board 广东利尔化学有限公司 2024-05-17 — — CN claimed
CN-110880603-B Copper foil with improved workability and charge/discharge characteristics, electrode comprising the same, secondary battery comprising the same, and method of manufacturing the same SK纳力世有限公司 2023-02-17 — — CN claimed
CN-115334778-A Pore-filling leveling agent and acidic copper electroplating bath containing same 广东利尔化学有限公司 2022-11-11 — — CN claimed
CN-110997983-B Crease-resistant copper foil, electrode comprising same, secondary battery comprising same, and method for manufacturing same SK纳力世有限公司 2022-10-21 — — CN claimed
CN-114277413-A Copper plating solution for circuit board 广东利尔化学有限公司 2022-04-05 — — CN claimed
CN-113481551-A Electrolyte additive of electrolytic copper foil, electrolyte, electrolytic copper foil and preparation method of electrolytic copper foil 河南科技大学 2021-10-08 — — CN claimed
US-10934625-B2 Process for metallization of an article having a plastic surface avoiding the metallization of the rack which fixes the article within the plating bath COVENTYA S.P.A. (IT) 2021-03-02 — — US claimed
US-20200181790-A1 COPPER FOIL FREE FROM GENERATION OF WRINKLES, ELECTRODE COMPRISING THE SAME, SECONDARY BATTERY COMPRISING THE SAME AND METHOD FOR MANUFACTURING THE SAME SK NEXILIS CO., LTD. (KR) 2020-06-11 — — US claimed
EP-3663438-A1 ANTI-CREASING COPPER FOIL, ELECTRODE COMPRISING SAME, SECONDARY BATTERY COMPRISING SAME, AND MANUFACTURING METHOD THEREFOR KCF Technologies Co., Ltd. (KR) 2020-06-10 — — EP claimed
EP-2723922-B1 ELECTROLYTE AND ITS USE FOR THE DEPOSITION OF BLACK RUTHENIUM COATINGS AND COATINGS OBTAINED IN THIS WAY UMICORE GALVANOTECHNIK GMBH (DE) 2019-08-28 — — EP claimed
US-20190112712-A1 PROCESS FOR METALLIZATION OF AN ARTICLE HAVING A PLASTIC SURFACE AVOIDING THE METALLIZATION OF THE RACK WHICH FIXES THE ARTICLE WITHIN THE PLATING BATH COVENTYA S.P.A. (IT) 2019-04-18 — — US claimed
EP-3440234-A1 PROCESS FOR METALLIZATION OF AN ARTICLE HAVING A PLASTIC SURFACE AVOIDING THE METALLIZATION OF THE RACK WHICH FIXES THE ARTICLE WITHIN THE PLATING BATH Coventya S.p.A. (IT) 2019-02-13 — — EP claimed
US-20190006658-A1 COPPER FOIL HAVING IMPROVED WORKABILITY AND CHARGE/DISCHARGE CHARACTERISTICS, ELECTRODE INCLUDING THE SAME, SECONDARY BATTERY INCLUDING THE SAME AND METHOD FOR MANUFACTURING THE SAME SK NEXILIS CO., LTD. (KR) 2019-01-03 — — US claimed
WO-2017174470-A1 PROCESS FOR METALLIZATION OF AN ARTICLE HAVING A PLASTIC SURFACE AVOIDING THE METALLIZATION OF THE RACK WHICH FIXES THE ARTICLE WITHIN THE PLATING BATH COVENTYA S.P.A. (IT) 2017-10-12 — — WO claimed
EP-3228729-A1 PROCESS FOR METALLIZATION OF AN ARTICLE HAVING A PLASTIC SURFACE AVOIDING THE METALLIZATION OF THE RACK WHICH FIXES THE ARTICLE WITHIN THE PLATING BATH COVENTYA S.p.A. (IT) 2017-10-11 — — EP claimed
EP-1651801-A2 AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION ATOTECH Deutschland GmbH (DE) 2006-05-03 — — EP claimed
WO-2005014891-A2 AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION ATOTECH DEUTSCHLAND GMBH (DE) 2005-02-17 — — WO claimed
WO-2004079044-A1 A CORROSION INHIBITING COMPOSITION FOR METALS COLUMBIA CHEMICAL CORPORATION (US) 2004-09-16 — — WO claimed
US-20040170848-A1 Corrosion inhibiting composition for metals COLUMBIA CHEMICAL CORPORATION 2004-09-02 — — US claimed
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