SCHEMBL29249205

SCHEMBL29249205

O=[N+]([O-])c1c(O)cc(F)cc1F.O=[N+]([O-])c1cc(F)c(F)cc1O

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TTR P02766 4/20 0.44
TDP1 Q9NUW8 3/20 0.43
ATM Q13315 1/20 0.43
GPR35 Q9HC97 4/20 0.39
ALDH1A1 P00352 4/20 0.39
MAPK1 P28482 3/20 0.39
KDM4E B2RXH2 3/20 0.39
MAPT P10636 3/20 0.39
HPGD P15428 2/20 0.39
ALOX15 P16050 2/20 0.39
HSD17B10 Q99714 2/20 0.39
MEN1 O00255 2/20 0.39
RECQL P46063 2/20 0.39
KMT2A Q03164 2/20 0.39
HIF1A Q16665 2/20 0.39
TP53 P04637 1/20 0.39
TSHR P16473 1/20 0.39
SMN1; SMN2 Q16637 1/20 0.39
CYP1A2 P05177 1/20 0.39
CYP2C9 P11712 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1680932 0.88 TTR (0.45) TTRTDP1ATMGPR35ALDH1A1
SCHEMBL29833735 0.88 TTR (0.45) TTRTDP1ATMGPR35ALDH1A1
SCHEMBL518140 0.84 GPR35 (0.50) TTRTDP1ATMGPR35ALDH1A1
SCHEMBL19306636 0.78 TTR (0.44) TTRTDP1ATMGPR35ALDH1A1
SCHEMBL30031583 0.75 TDP1 (0.50) TTRTDP1ATMGPR35ALDH1A1
SCHEMBL2326899 0.75 TDP1 (0.50) TTRTDP1ATMGPR35ALDH1A1
SCHEMBL4647699 0.75 TDP1 (0.55) TTRTDP1ATMGPR35ALDH1A1
SCHEMBL104470 0.74 TDP1 (0.52) TTRTDP1ATMALDH1A1HIF1A
SCHEMBL744876 0.74 TDP1 (0.46) TTRTDP1ATMGPR35ALDH1A1
SCHEMBL4297784 0.74 TDP1 (0.46) TTRTDP1ATMGPR35ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-115044040-B Polyimide-containing polymer, positive photosensitive resin composition, negative photosensitive resin composition, and pattern forming method 信越化学工业株式会社 2024-07-02 CN disclosed