SCHEMBL2925233

SCHEMBL2925233

CCCCCCCCCCCCCCCCCCOP(O)Oc1ccc(C(C)(C)C)cc1C(C)(C)C

nearest known ligand 0.41

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
THRA P10827 1/20 0.41
THRB P10828 1/20 0.41
ESR1 P03372 2/20 0.38
GHSR Q92847 1/20 0.35
MAPT P10636 1/20 0.34
MAPK1 P28482 1/20 0.34
NPSR1 Q6W5P4 1/20 0.34
KDM4E B2RXH2 2/20 0.34
RECQL P46063 1/20 0.34
GAA P10253 1/20 0.34
SMN1; SMN2 Q16637 1/20 0.34
CNR1 P21554 1/20 0.33
CNR2 P34972 1/20 0.33
S1PR1 P21453 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2710797 1.00 THRA (0.41) THRATHRBESR1GHSRMAPT
SCHEMBL7114551 1.00 THRA (0.41) THRATHRBESR1GHSRMAPT
SCHEMBL7954050 1.00 THRA (0.41) THRATHRBESR1GHSRMAPT
SCHEMBL19026571 1.00 THRA (0.41) THRATHRBESR1GHSRMAPT
SCHEMBL7951307 1.00 THRA (0.41) THRATHRBESR1GHSRMAPT
SCHEMBL7942236 1.00 THRA (0.41) THRATHRBESR1GHSRMAPT
SCHEMBL7948647 1.00 THRA (0.41) THRATHRBESR1GHSRMAPT
SCHEMBL28053787 0.94 THRA (0.38) THRATHRBESR1GHSRKDM4E
SCHEMBL28428459 0.88 ESR1 (0.47) THRATHRBESR1KDM4ERECQL
SCHEMBL4965655 0.88 THRA (0.40) THRATHRBESR1GHSRKDM4E

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116769260-A Styrene resin composition, molded article using same, and carrier tape for transporting electronic component PS日本株式会社 2023-09-19 CN disclosed
CN-109233127-B Extruded sheet and preparation method thereof 北京奥克森节能环保科技有限公司 2021-02-12 CN disclosed
WO-2021002192-A1 HEAT RESISTANCE STABILIZING AID AND HEAT RESISTANCE STABILIZER COMPOSITION 株式会社ADEKA 2021-01-07 WO disclosed
CN-108368247-B Aromatic polycarbonate resin, aromatic polycarbonate resin composition, and method for producing aromatic polycarbonate resin molded article 三菱化学株式会社 2020-08-14 CN disclosed
CN-108368249-B Flow modifier for thermoplastic resin and thermoplastic resin composition containing same 三菱化学株式会社 2020-07-10 CN disclosed
WO-2020045554-A1 COMPOSITION, THERMOPLASTIC RESIN COMPOSITION CONTAINING SAME, AND MOLDED ARTICLE OF SAID THERMOPLASTIC RESIN COMPOSITION 株式会社ADEKA 2020-03-05 WO disclosed
WO-2020022189-A1 ADDITIVE COMPOSITION, POLYOLEFIN RESIN COMPOSITION CONTAINING SAME, METHOD FOR PRODUCING POLYOLEFIN RESIN COMPOSITION, AND MOLDED ARTICLES THEREOF 株式会社ADEKA 2020-01-30 WO disclosed
US-20190186841-A1 THERMAL MANAGEMENT DEVICES AND METHODS OF MAKING THE SAME SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2019-06-20 US disclosed
EP-3455571-A1 THERMAL MANAGEMENT DEVICES AND METHODS OF MAKING THE SAME SABIC Global Technologies B.V. (NL) 2019-03-20 EP disclosed
CN-109477697-A Thermal management device and preparation method thereof 沙特基础工业全球技术有限公司 2019-03-15 CN disclosed
WO-2008079438-A1 THERMALLY CONDUCTING AND ELECTRICALLY INSULATING MOLDABLE COMPOSITIONS AND METHODS OF MANUFACTURE THEREOF SABIC INNOVATIVE PLASTICS IP B.V. (NL) 2008-07-03 WO disclosed
US-20080153959-A1 Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof GENERAL ELECTRIC COMPANY (US) 2008-06-26 US disclosed
US-20050106348-A1 Wire-protective tube YAZAKI CORPORATION 2005-05-19 US disclosed
US-6852921-B1 Wire-protective tube YAZAKI CORPORATION (JP) 2005-02-08 US disclosed
US-6689835-B2 ELECTROCONDUCTIVE FILLER SYSTEM CONTAINING OF CARBON FIBERS, CARBON POWDER, NONCONDUCTIVE FILLER; ARTICLES MADE FROM THESE COMPOSITIONS CAN BE USED FOR ELECTROMAGNETIC SHIELDING, ELECTROSTATIC DISSIPATION OR ANTISTATIC IN PACKAGING GENERAL ELECTRIC COMPANY 2004-02-10 US disclosed
US-20030181568-A1 Conductive plastic compositions and method of manufacture thereof AMARASEKERA JAYANTHA (US) 2003-09-25 US disclosed
US-20020183438-A1 Electroconductive filler system containing of carbon fibers, carbon powder, nonconductive filler; articles made from these compositions can be used for electromagnetic shielding, electrostatic dissipation or antistatic in packaging SABIC GLOBAL TECHNOLOGIES B.V. (NL) 2002-12-05 US disclosed
US-6231804-B1 USED FOR HOLLOW CONTAINERS, A FILM, A SHEET, A PIPE, FIBER AND MOLDING;A BLEND OF HIGH MOLECULAR WEIGHT POLYETHYLENE COPOLYMER,AN OLEFIN HOMO OR COPLYMER CHISSO CORPORATION (JP) 2001-05-15 US disclosed
EP-0972800-A1 MODIFIED OLEFIN (CO)POLYMER COMPOSITION, PROCESS FOR PREPARING THE SAME, AND MODIFIED OLEFIN (CO)POLYMER COMPOSITION MOLDING CHISSO CORPORATION (JP) 2000-01-19 EP disclosed
EP-0336606-B1 COMPOSITION OF STABILIZED SYNTHETIC RESIN ASAHI DENKA KOGYO KABUSHIKI KAISHA (JP) 1993-09-08 EP disclosed